Patent Assignment
Reel/Frame 024846/0923
Assignment of Assignor's Interest
Recorded: 2010-08-17
Pages: 2
Assignors
PARK, JI-HYUN
Executed: 2010-08-06
KWON, HEUNGKYU
Executed: 2010-08-06
NA, MIN-OK
Executed: 2010-08-06
KIM, TAEHWAN
Executed: 2010-08-06
Assignee
SAMSUNG ELECTRONICS CO., LTD
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Manufacturing the Same