Patent Assignment
Reel/Frame 024848/0622
Assignment of Assignor's Interest
Recorded: 2010-08-17
Pages: 5
Assignors
LIN, CHUNG-HSIEN
Executed: 2010-08-06
CHENG, CHUN-WEN
Executed: 2010-08-09
CHU, CHIA-HUA
Executed: 2010-08-06
TSAI, YI HENG
Executed: 2010-08-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., ("TSMC")
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Microstructure Device with an Improved Anchor