Patent Assignment
Reel/Frame 024851/0687
Assignment of Assignor's Interest
Recorded: 2010-08-18
Pages: 4
Assignors
SHIH, YING-CHING
Executed: 2010-07-14
WU, WENG-JIN
Executed: 2010-07-14
LIN, JING-CHENG
Executed: 2010-07-14
CHIOU, WEN-CHIH
Executed: 2010-07-14
JENG, SHIN-PUU
Executed: 2010-08-03
YU, CHEN-HUA
Executed: 2010-08-03
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Composite Carrier Structure