Patent Assignment
Reel/Frame 024857/0177
Assignment of Assignor's Interest
Recorded: 2010-08-18
Pages: 2
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADA-MACHI, NAGANO-SHI, NAGANO, 381-2287, JAPAN
Covered Property
(1)
Method of Manufacturing Semiconductor Package