IP Library Assignment 024860/0851
Patent Assignment
Reel/Frame 024860/0851

Assignment of Assignor's Interest

Recorded: 2010-08-19 Pages: 3
Assignors
KIM, BRIAN H.
Executed: 2010-07-26
LEE, SIMON S.
Executed: 2010-07-26
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95052
Covered Property (1)
Optical Connection Through Single Assembly Overhang Flip Chip Optics Die with Micro Structure Alignment
Patent: 8,373,259 →
Application: 12/844,656 →
Publication: US 2012/0025209