Merger

Recorded: 2010-08-20 Pages: 6

Assignor

FURUKAWA CIRCUIT FOIL CO., LTD.

Executed: 2008-10-01

Assignee

THE FURUKAWA ELECTRIC CO., LTD

2-3 MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN

Covered Property (1)

Ultrathin Copper Foil with Carrier and Printed Circuit Board Using Same

Patent: 7,985,488 →

Application: 12/827,018 →

Publication: US 2010/0270063

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.