Patent Assignment
Reel/Frame 024906/0121
Merger
Recorded: 2010-08-30
Pages: 10
Assignor
RENESAS TECHNOLOGY CORP.
Executed: 2010-04-01
Assignee
RENESAS ELECTRONICS CORPORATION
1753, SHIMONUMABE, NAKAHARA-KU, KAWASAKI-SHI, JAPAN
Covered Properties
(8)
Semiconductor Device Incorporating Internal Power Supply for Compensating for Deviation in Operating Condition and Fabrication Process Conditions
Patent:
5,396,116 →
Application:
07/984,822 →
Semiconductor Device Incorporating Main and Stand-by Boosted Internal Power Supply for Compensating for Deviation on Operating Condition and Fabrication Process Conditions
Patent:
5,377,156 →
Application:
07/985,076 →
Semiconductor Memory System with the Function of the Replacement to the Other Chips
Patent:
5,469,390 →
Application:
08/301,284 →
Semiconductor Device Incorporating Internal Power Supply for Compensating for Deviation in Operating Condition and Fabrication Process Conditions
Patent:
5,822,267 →
Application:
08/305,528 →
Radio Communication Apparatus and Semiconductor Device
Patent:
6,775,525 →
Application:
09/697,210 →
Semiconductor Integrated Circuit Apparatus
Video Capture Device
Semiconductor Integrated Circuit Apparatus
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 26, 2003
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 014547/0428 →
Assignment of Assignor's Interest
Dec 3, 2003
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 014754/0218 →
Assignment of Assignor's Interest
Apr 16, 2004
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 015228/0386 →
Assignment of Assignor's Interest
Sep 26, 2007
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 019881/0292 →