Patent Assignment
Reel/Frame 019881/0292
Assignment of Assignor's Interest
Recorded: 2007-09-26
Pages: 4
Assignor
HITACHI, LTD.
Executed: 2007-03-29
Assignee
RENESAS TECHNOLOGY CORP.
4-1, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Properties
(6)
Resin Encapsulating Apparatus for Semiconductor Devices
Patent:
4,983,110 →
Application:
07/323,497 →
Method for Encapsulating Semiconductor Chips
Patent:
5,110,515 →
Application:
07/353,256 →
Multiprocessor System Having Shared Memory Divided into a Plurality of Banks with Access Queues Corresponding to Each Bank
Patent:
5,375,215 →
Application:
07/784,546 →
Mask Structure Having Phase Shifting Pattern Suitable for Forming Fine Pattern on Photosensitive Film and Method of Manufacturing Solid- State Devices Using Such Mask Structure
Patent:
5,604,059 →
Application:
08/290,603 →
Semiconductor Memory System with the Function of the Replacement to the Other Chips
Patent:
5,469,390 →
Application:
08/301,284 →
Trouser Pressing Apparatus
Patent:
5,967,386 →
Application:
09/120,541 →
Related Assignments
(2)
Other recorded transfers of the patents in this record — the chain of ownership.