Granted Patent
Utility
US 4,983,110 · App. 07/323,497
Resin encapsulating apparatus for semiconductor devices
Inventors:
Isamu Yoshida, Junichi Saeki, Shigeharu Tsunoda, Kunihiko Nishi, Masao Mitani
Patented Case
View Patent ↗
Granted: Jan 8, 1991
Filed: Mar 13, 1989
Inventors
Isamu Yoshida
Junichi Saeki
Shigeharu Tsunoda
Kunihiko Nishi
Masao Mitani
Assignee (at issue)
HITACHI, LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.