Patent Assignment
Reel/Frame 024937/0544
Assignment of Assignor's Interest
Recorded: 2010-09-03
Pages: 6
Assignors
LEE, JUNG-DO
Executed: 2010-08-30
KIM, JONGKOOK
Executed: 2010-08-30
LEE, SEOKWON
Executed: 2010-08-30
LEE, JAESIK
Executed: 2010-08-16
IM, HOHYEUK
Executed: 2010-08-30
PARK, SU-MIN
Executed: 2010-08-30
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU,, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Chips Having Guard Rings and Methods of Fabricating the Same