IP Library › Assignment 024960/0843
Patent Assignment
Reel/Frame 024960/0843

Assignment of Assignor's Interest

Recorded: 2010-09-09 Pages: 7
Assignors
ENGEL, RAYMOND W.
Executed: 2007-06-04
SHARMA, NIRMAL
Executed: 2007-07-25
TAYLOR, WILLIAM P.
Executed: 2007-05-10
Assignee
ALLEGRO MICROSYSTEMS, INC.
115 NORTHEAST CUTOFF, WORCESTER, MASSACHUSETTS, 01606
Covered Property (1)
Methods for Multi-Stage Molding of Integrated Circuit Package
Patent: 8,143,169 →
Application: 12/878,134 →
Publication: US 2010/0330708
Related Assignments (6)
Other recorded transfers of the patent in this record — the chain of ownership.
Conversion and Name Change Apr 10, 2013
From: ALLEGRO MICROSYSTEMS, INC.
To: ALLEGRO MICROSYSTEMS, LLC
Reel/Frame 030426/0178 →
Patent Security Agreement Oct 1, 2020
From: ALLEGRO MICROSYSTEMS, LLC
To: MIZUHO BANK LTD., AS COLLATERAL AGENT
Reel/Frame 053957/0620 →
Patent Security Agreement Oct 1, 2020
From: ALLEGRO MICROSYSTEMS, LLC
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT
Reel/Frame 053957/0874 →
Release of Security Interest in Patents (R/F 053957/0620) Jun 22, 2023
From: MIZUHO BANK, LTD., AS COLLATERAL AGENT
To: ALLEGRO MICROSYSTEMS, LLC
Reel/Frame 064068/0360 →
Patent Security Agreement Jun 22, 2023
From: ALLEGRO MICROSYSTEMS, LLC
To: MORGAN STANLEY SENIOR FUNDING, INC., AS THE COLLATERAL AGENT
Reel/Frame 064068/0459 →
Release of Security Interest in Patents at Reel 053957/Frame 0874 Nov 1, 2023
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT
To: ALLEGRO MICROSYSTEMS, LLC
Reel/Frame 065420/0572 →