Patent Assignment
Reel/Frame 024978/0827
Assignment of Assignor's Interest
Recorded: 2010-09-13
Pages: 2
Assignor
ANG, TING CHEONG
Executed: 2007-05-30
Assignee
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
18 ZHANG JIANG ROAD, PUDONG NEW AREA, SHANGHAI, 201203, CHINA
Covered Property
(1)
Method with High Gapfill Capability for Semiconductor Devices