Patent Assignment
Reel/Frame 025001/0583
Assignment of Assignor's Interest
Recorded: 2010-09-16
Pages: 4
Assignors
HSIAO, YI-LI
Executed: 2010-09-06
YU, CHEN-HUA
Executed: 2010-09-06
JENG, SHIN-PUU
Executed: 2010-09-06
TUNG, CHIH-HANG
Executed: 2010-09-06
WEI, CHENG-CHANG
Executed: 2010-09-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Semiconductor Device and Bump Formation Process
Application:
12/883,950 →
Publication:
US 2011/0186989