Patent Assignment
Reel/Frame 025005/0135
Assignment of Assignor's Interest
Recorded: 2010-09-17
Pages: 5
Assignors
CHANG, HUNG-PIN
Executed: 2010-09-01
LIN, YUNG-CHI
Executed: 2010-09-01
YU, CHIA-LIN
Executed: 2010-09-01
HUNG, JUI-PIN
Executed: 2010-09-01
HWANG, CHIEN-LING
Executed: 2010-09-01
YU, CHEN-HUA
Executed: 2010-09-01
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN ROAD 6, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Thermally Efficient Packaging for a Photonic Device
Application:
12/884,570 →
Publication:
US 2012/0068218
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 12, 2012
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
To: TSMC SOLID STATE LIGHTING LTD
Reel/Frame 028033/0052 →
Merger
Feb 23, 2016
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037805/0571 →
Change of Name
Feb 23, 2016
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037809/0929 →