IP Library › Assignment 037809/0929
Patent Assignment
Reel/Frame 037809/0929

Change of Name

Recorded: 2016-02-23 Pages: 15
Assignor
TSMC SOLID STATE LIGHTING LTD.
Executed: 2015-04-02
Assignee
CHIP STAR LTD.
NO. 9 LIXING 4TH RD., HSINCHU SCIENCE AND INDUSTRIAL PARK, HSINCHU CITY, TAIWAN
Covered Properties (10)
Gallium Nitride Device Substrate Containing a Lattice Parameter Altering Element
Patent: 7,273,798 →
Application: 11/194,237 →
Publication: US 2007/0032041
Light-Emitting Diode with Textured Substrate
Patent: 8,058,082 →
Application: 12/189,635 →
Publication: US 2010/0032696
Reflective Layer Between Light-Emitting Diodes
Patent: 8,716,723 →
Application: 12/270,309 →
Publication: US 2010/0038655
Thermally Efficient Packaging for a Photonic Device
Application: 12/884,570 →
Publication: US 2012/0068218
Lighting Device for Direct and Indirect Lighting
Patent: 9,140,421 →
Application: 13/209,258 →
Publication: US 2013/0039041
Method of Growing a High Quality Iii-V Compound Layer on a Silicon Substrate
Patent: 9,691,855 →
Application: 13/398,954 →
Publication: US 2013/0214281
Optimizing Light Extraction Efficiency for an Led Wafer
Patent: 9,324,624 →
Application: 13/431,165 →
Publication: US 2013/0260484
III-V Group Compound Devices with Improved Efficiency and Droop Rate
Patent: 9,099,593 →
Application: 13/616,299 →
Publication: US 2014/0077152
Pre-Cutting a Back Side of a Silicon Substrate for Growing Better III-V Group Compound Layer on a Front Side of the Substrate
Patent: 8,981,534 →
Application: 13/616,415 →
Publication: US 2014/0077224
Multi-Vertical LED Packaging Structure
Patent: 9,136,442 →
Application: 13/750,097 →
Publication: US 2014/0209930
Related Assignments (7)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 4, 2012
From: LI, ZHEN-YU; LIN, CHUNG-PAO; HSIA, HSING-KUO; KUO, HAO-CHUNG
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 029403/0652 →
Assignment of Assignor's Interest Dec 13, 2012
From: LI, ZHEN-YU; LIN, HON-WAY; LIN, CHUNG-PAO; HSIA, HSING-KUO
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 029460/0136 →
Assignment of Assignor's Interest Jan 25, 2013
From: WENG, JUI-PING; LEE, HSIAO-WEN; CHANG, CHUN-CHIH; WU, MIN-SHENG
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 029694/0054 →
Merger Feb 23, 2016
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037805/0571 →
Corrective Assignment to Correct the Assignee Name Previously Recorded at Reel: 017206 Frame: 0666. Assignor(S) Hereby Confirms the Assignment. May 6, 2016
From: AGILENT TECHNOLOGIES, INC.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 038632/0662 →
Assignment of Assignor's Interest Dec 17, 2025
From: EPISTAR CORPORATION
To: TAU CETI VENTURES LLC
Reel/Frame 073969/0972 →
Change of Name Apr 22, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075513/0783 →