Patent Assignment
Reel/Frame 073969/0972
Assignment of Assignor's Interest
Recorded: 2025-12-17
Pages: 11
Assignor
EPISTAR CORPORATION
Executed: 2025-10-21
Assignee
TAU CETI VENTURES LLC
17330 PRESTON ROAD, SUITE 200D, DALLAS, TEXAS, 75252
Covered Properties
(68)
Device and Method for Providing Illuminating Light Using Quantum Dots
Backlight Module Having Independent Light Source
Illumination Apparatus
Illumination Package
Light-Emitting Diode Chip
Package for a Light Emitting Element with Integrated Electrostatic Discharge Protection
Flip-Chip Packaging Structure for Light Emitting Diode and Method Thereof
Light Emitting Device and Method of Forming the Same
Illumination Package
Light Emitting Device Having a Patterned Substrate and the Method Thereof
Illumination Apparatus
Flip-Chip Packaging Method for Light Emitting Diode with Eutectic Layer Not Overlapping Insulating Layer
Omnidirectional Reflector
Package for a Light Emitting Element
Reflective Layer Between Light-Emitting Diodes
Optoelectronic Device
Light Emitting Device and Method of Forming the Same
Lighting Devices
Light-Emitting Diode Integration Scheme
Light-Emitting Device Having a Patterned Surface
Optoelectronic Device
Light-Emitting Device Having a Patterned Substrate and the Method Thereof
Light Emitting Device
Double Substrate Multi-Junction Light Emitting Diode Array Structure
Led Lamp and Method of Making the Same
Integrated Lighting Apparatus Having a Control Device and Method of Manufacturing the Same
Wafer Level Photonic Device Die Structure and Method of Making the Same
Light-Emitting Device and the Manufacturing Method Thereof
Package for a Light Emitting Element
Light Emitting Structure Having Electrodes and Manufacturing Method Thereof
Light-Emitting Diode Integration Scheme
Led Module and Method of Bonding Thereof
Light Emitting Device with Reflective Electrode
Light-Emitting Device
Engineered-Phosphor Led Package and Related Methods
Patent:
8,754,435 →
Application:
13/770,432 →
Omnidirectional Reflector
Led Lamp and Method of Making the Same
Engineered-Phosphor Led Packages and Related Methods
Patent:
8,659,043 →
Application:
13/864,801 →
Engineered-Phosphor Led Packages and Related Methods
Omnidirectional Reflector
Light-Emitting Device and the Manufacturing Method Thereof
Engineered-Phosphor Led Packages and Related Methods
Patent:
8,722,439 →
Application:
14/095,419 →
Wafer Level Photonic Device Die Structure and Method of Making the Same
Light-Emitting Device Having a Patterned Surface
Led Module and Method of Bonding Thereof
Engineered-Phosphor Led Packages and Related Methods
Method of Forming Light-Generating Device Including Reflective Layer
Intergrated Lighting Apparatus and Method of Manufacturing the Same
Engineered-Phosphor Led Packages and Related Methods
Light Emitting Structure Having Electrodes Forming a Concave Surface and Manufacturing Method Thereof
Led Module and Method of Bonding Thereof
Doubled Substrate Multi-Junction Light Emitting Diode Array Structure
Engineered-Phosphor Led Packages and Related Methods
Light-Emitting Device Including Reflective Layer
Wafer Level Photonic Device Dies Structure and Method of Making the Same
Light-Emitting Device Having a Patterned Substrate and the Method Thereof
Light-Emitting Device Having a Patterned Surface
Light Emitting Device with Reflective Electrode
Light Emitting Structure and a Manufacturing Method Thereof
Light-Emitting Device Having a Patterned Surface
Lighting Apparatuses and Led Modules for Both Illumination and Optical Communication
Light-Emitting Device
A Light Emitting Structure
Light-Emitting Device Having a Patterned Substrate and the Method Thereof
Light-Emitting Device Having a Patterned Surface
Light-Emitting Device Having a Patterned Substrate and the Method Thereof
Light-Emitting Device Having a Patterned Surface
Light-Emitting Device Having a Patterned Substrate and the Method Thereof
Related Assignments
(13)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 3, 2015
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
To: CHIP STAR LTD.
Reel/Frame 036543/0245 →
Change of Name
Dec 2, 2015
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037195/0724 →
Merger
Dec 2, 2015
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037195/0738 →
Change of Name
Feb 23, 2016
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037809/0929 →
Merger
Feb 23, 2016
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037805/0571 →
Change of Name
Mar 26, 2016
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 038263/0076 →
Merger
Mar 26, 2016
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 038107/0930 →
Merger
Mar 26, 2016
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 038107/0949 →
Merger
Mar 26, 2016
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 038107/0962 →
Corrective Assignment to Correct the Assignee Name Previously Recorded at Reel: 017206 Frame: 0666. Assignor(S) Hereby Confirms the Assignment.
May 6, 2016
From: AGILENT TECHNOLOGIES, INC.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 038632/0662 →
Assignment of Assignor's Interest
Sep 26, 2016
From: FORMOSA EPITAXY INCORPORATION
To: EPISTAR CORPORATION
Reel/Frame 040149/0765 →
Assignment of Assignor's Interest
Oct 13, 2016
From: HUGA OPTOTECH INC.
To: EPISTAR CORPORATION
Reel/Frame 040350/0699 →
Change of Name
Apr 22, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075513/0783 →