IP Library Granted Patent US 10,566,509
Granted Patent B2
US 10,566,509 · App. 15/688,339 · Granted Feb 18, 2020

Light emitting structure

Inventor: Chia-Liang Hsu (Hsinchu, TW)
Assignee: EPISTAR CORPORATION
H01L33/60H01L33/38H01L33/486H01L33/507H01L33/54H01L33/58H01L33/62H01L33/0079H01L2224/16H01L2933/0033H01L2933/0066
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Quick Facts
Patent No.
US 10,566,509
App. No.
15/688,339
Granted
Feb 18, 2020
Kind
B2
Abstract

A light-emitting structure includes a semiconductor light-emitting element, a first connection point and a reflective element. The semiconductor light-emitting element includes a bottom surface, a top surface opposite to the bottom surface, and a side surface arranged between the bottom surface and the top surface. The first connection point is arranged on the bottom surface. The reflective element includes a first portion arranged right beneath the bottom surface, and a second portion not overlapping the bottom surface and uplifted from a lower elevation lower than the bottom surface to a higher elevation substantially equal to that of the top surface along a curved path.

Claims (27)

1. A light-emitting structure, comprising:

a semiconductor light-emitting element comprising a bottom surface, a top surface opposite to the bottom surface, and a side surface arranged between the bottom surface and the top surface;

a first connection point arranged under the bottom surface; and

a reflective element, comprising an inner sidewall having a first portion arranged right beneath the bottom surface, and a second portion not overlapping the bottom surface and uplifted from a lower elevation lower than the bottom surface to a higher elevation substantially equal to that of the top surface along a curved path,

wherein the curved path has a first slope variation from a first smaller value to a first greater value, and a second slope variation from a second greater value to a second smaller value.

2. The light-emitting structure of claim 1 , wherein the first connection point contacts the reflective element.

3. The light-emitting structure of claim 1 , wherein the reflective element further comprises an outer surface substantially parallel to the side surface and connected to the second portion.

4. The light-emitting structure of claim 1 , wherein the bottom surface has a portion not covered by the reflective element.

5. The light-emitting structure of claim 1 , further comprising a wavelength conversion layer formed on the top surface.

6. The light-emitting structure of claim 5 , wherein the wavelength conversion layer comprises a topmost surface higher than the second portion.

7. The light-emitting structure of claim 5 , wherein the wavelength conversion layer directly contacts the top surface.

8. The light-emitting structure of claim 5 , wherein the wavelength conversion layer is extended beyond the side surface.

9. The light-emitting structure of claim 1 , wherein the reflective element has an uppermost surface, a lowermost surface opposite to the uppermost surface, and a space between the uppermost surface and the lowermost surface which is fully occupied by a single material.

10. The light-emitting structure of claim 1 , further comprising a second connection point arranged under the bottom surface.

11. The light-emitting structure of claim 10 , wherein the reflective element has a part arranged between the first connection point and the second connection point.

12. A light-emitting structure, comprising:

a semiconductor light-emitting element comprising a bottom surface, a top surface opposite to the bottom surface, and a side surface arranged between the bottom surface and the top surface;

a first connection point and a second connection point arranged under the bottom surface; and

a reflective element, comprising a part arranged between the first connection point and the second connection point and an inner sidewall having a first portion arranged right beneath the bottom surface, and a second portion not overlapping the bottom surface and uplifted from a lower elevation lower than the bottom surface to a higher elevation substantially equal to that of the top surface along a curved path,

wherein the semiconductor light-emitting element is separated from the second portion by a distance which is gradually increased along a direction normal to the side surface, and

wherein the curved path has a first slope variation from a first smaller value to a first greater value, and a second slope variation from a second greater value to a second smaller value.

13. The light-emitting structure of claim 12 , wherein the second portion comprises a curved surface, a beveled surface, or a combination thereof.

14. The light-emitting structure of claim 12 , further comprising a wavelength conversion layer formed on the top surface.

15. The light-emitting structure of claim 14 , wherein the wavelength conversion layer comprises a topmost surface higher than the second portion.

16. The light-emitting structure of claim 14 , wherein the wavelength conversion layer directly contacts the top surface.

17. The light-emitting structure of claim 14 , wherein the wavelength conversion layer is extended beyond the side surface.

18. The light-emitting structure of claim 12 , wherein the reflective element has an uppermost surface, a lowermost surface opposite to the uppermost surface and a space between the uppermost surface and the lowermost surface which is fully occupied by a single material.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 17, 2025
From: EPISTAR CORPORATION
To: TAU CETI VENTURES LLC
Reel/Frame 073969/0972 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 29, 2017
From: HSU, CHIA-LIANG
To: EPISTAR CORPORATION
Reel/Frame 043435/0748 →