IP Library › Assignment 038107/0949
Patent Assignment
Reel/Frame 038107/0949

Merger

Recorded: 2016-03-26 Pages: 13
Assignor
CHIP STAR LTD.
Executed: 2015-07-15
Assignee
EPISTAR CORPORATION
5 LI HSIN 5TH RD., SCIENCE BASED INDUSTRIAL PARK, HSINCHU, TAIWAN
Covered Properties (15)
Package for a Light Emitting Element with Integrated Electrostatic Discharge Protection
Patent: 7,528,422 →
Application: 11/336,094 →
Publication: US 2007/0170450
Spacers for Wafer Bonding
Application: 11/621,045 →
Publication: US 2008/0164606
Fabrication Process for Package with Light Emitting Device on a Sub-Mount
Patent: 7,732,234 →
Application: 11/675,179 →
Publication: US 2008/0199982
Fabrication of Compact Semiconductor Packages
Application: 12/014,443 →
Publication: US 2009/0181500
Optoelectronic Device Submount
Patent: 7,732,829 →
Application: 12/026,113 →
Publication: US 2009/0194777
Silicon-Based Sub-Mount for an Opto-Electronic Device
Patent: 8,309,973 →
Application: 12/369,993 →
Publication: US 2010/0200888
Semiconductor-Based Sub-Mounts for Optoelectronic Devices with Conductive Paths to Facilitate Testing and Binning
Patent: 7,838,878 →
Application: 12/409,859 →
Publication: US 2010/0244055
Light-Emitting Diode Integration Scheme
Patent: 8,058,669 →
Application: 12/535,525 →
Publication: US 2010/0051972
Refractive Index Tuning of Wafer Level Package Leds
Patent: 9,024,341 →
Application: 12/912,900 →
Publication: US 2012/0104435
Batwing Beam Based Led and Backlight Module Using the Same
Application: 13/273,470 →
Publication: US 2012/0113621
Formation of through-wafer electrical interconnections and other structures using a thin etch-stop membrane
Application: 60/848,043 →
Light Emitting Device Package
Application: 61/076,263 →
Conductive Feed-Through in Semiconductor Material
Application: 61/144,525 →
LED Linear Regulator Circuit with Improved Power Factor
Application: 61/778,043 →
Method and apparatus for packaging phosphor-coated LEDs
Application: 61/783,610 →
Related Assignments (4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 26, 2012
From: LEE, HSIAO-WEN; TSAI, SHANG-YU; LIN, TIEN-MING; CHERN, CHYI SHYUAN
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
Reel/Frame 029200/0155 →
Assignment of Assignor's Interest Sep 3, 2015
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
To: CHIP STAR LTD.
Reel/Frame 036543/0245 →
Assignment of Assignor's Interest Dec 17, 2025
From: EPISTAR CORPORATION
To: TAU CETI VENTURES LLC
Reel/Frame 073969/0972 →
Change of Name Apr 22, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075513/0783 →