IP Library › Patent Application 60848043
Patent Application Provisional Small
App. No. 60/848,043 · Confirmation No. 9093

Formation of through-wafer electrical interconnections and other structures using a thin etch-stop membrane

Inventor: Lior Shiv
Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2016-07-25 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2016-07-14 PA.. Power of Attorney 1 View
2016-07-14 N417 Electronic Filing System Acknowledgment Receipt 2 View
2016-07-14 TRAN.LET Transmittal Letter 1 View
2016-07-14 R3.73 Assignee showing of ownership per 37 CFR 3.73 1 View
2006-09-26 TRNA Transmittal of New Application 1 View
2006-09-26 SPEC Specification 7 View
2006-09-26 DRW Drawings-only black and white line drawings 2 View
2006-09-26 WFEE Fee Worksheet (SB06) 1 View
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Quick Facts
App. No.
60/848,043
Filed
2006-09-26