Patent Assignment
Reel/Frame 036543/0245
Assignment of Assignor's Interest
Recorded: 2015-09-03
Pages: 6
Assignor
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Executed: 2015-06-24
Assignee
CHIP STAR LTD.
NO. 9, LI-HSIN 4TH RD., HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Properties
(67)
Programmable Led Driver Pad
Patent:
6,266,000 →
Application:
09/303,797 →
Hybrid Integration of Active and Passive Optical Components on an Si-Board
Patent:
6,832,013 →
Application:
10/030,639 →
Encapsulated Optical Fiber End-Coupled Device
Semiconductor Structure with One or More Through-Holes
Optical Package with an Integrated Lens and Optical Assemblies Incorporating the Package
Package with a Light Emitting Device
Phosphor for Use in White Semiconductor Light Sources and a White Light Source Utilizing the Same
Optical Device Receiving Substrate and Optical Device Holding Carrier
Accurate Positioning of Components of an Optical Assembly
Three-dimensional inductive micro components
Application:
10/699,981 →
Publication:
US 2005/0093667
Adjustable Spectrum Flash Lighting for Image Acquisition
Method and Apparatus for Producing Untainted White Light Using Off-White Light Emitting Diodes
Light Transmitting Modules with Optical Power Monitoring
Hermetically Sealed Package for Optical, Electronic, Opto-Electronic and Other Devices
A Method of Forming an Assembly to House One or More Micro Components
Assembly with Self-Alignment Features to Position a Cover on a Substrate That Supports a Micro Component
Semiconductor Structures Having Through-Holes Sealed with Feed-Through Metalization
Illumination Apparatus and Method
Light Source with Wavelength Converting Material
Semiconductor Structure with One or More Through-Holes
Method and Apparatus Using Liquid Crystal Light Valve to Filter Incident Light on a Photodetector
Device and Method for Emitting Output Light Using Quantum Dots and Non-Quantum Fluorescent Material
Device and Method for Providing Illuminating Light Using Quantum Dots
Flash Module with Quantum Dot Light Conversion
Light-Emitting Diode Flash Module with Enhanced Spectral Emission
Method of Fabricationg a Package for a Micro Component
Microelectromechanical systems (MEMS) devices integrated in a hermetically sealed package
Application:
11/144,429 →
Publication:
US 2005/0269688
Fabrication and Use of Polished Silicon Micro-Mirrors
Method of fabrication for chip scale package for a micro component
Optical Module Hermetically Packaged in Micro-Machined Structures
Package for a Light Emitting Element with Integrated Electrostatic Discharge Protection
Method and Apparatus for Producing Untainted White Light Using Off-White Emitting Diodes
Hermetically Sealed Package for Optical, Electronic, Opto-Electronic and Other Devices
Sealed Package With Glass Window for Optoelectronic Components, and Assemblies Incorporating the Same
Application:
11/558,175 →
Publication:
US 2007/0120041
Light Transmitting Modules with Optical Power Monitoring
Spacers for Wafer Bonding
Application:
11/621,045 →
Publication:
US 2008/0164606
Fabrication Process for Package with Light Emitting Device on a Sub-Mount
Accurate Positioning of Components of an Optical Assembly
Gallium Nitride Device Substrate Containing a Lattice Parameter Altering Element
Fabrication of Compact Semiconductor Packages
Application:
12/014,443 →
Publication:
US 2009/0181500
Optoelectronic Device Submount
Chip Scale Package For A Micro Component
Application:
12/143,003 →
Publication:
US 2008/0315390
Silicon-Based Sub-Mount for an Opto-Electronic Device
Semiconductor-Based Sub-Mounts for Optoelectronic Devices with Conductive Paths to Facilitate Testing and Binning
Semiconductor-Based Submount with Electrically Conductive Feed-Throughs
Application:
12/430,591 →
Publication:
US 2010/0176507
Light-Emitting Diode Integration Scheme
Refractive Index Tuning of Wafer Level Package Leds
Semiconductor-Based Sub-Mounts for Optoelectronic Devices with Conductive Paths
Fabrication of Compact Opto-Electronic Component Packages
Light Emitting Diode Package with Photoresist Reflector and Method of Manufacturing
Application:
13/178,108 →
Publication:
US 2012/0098006
Light-Emitting Diode Integration Scheme
Batwing Beam Based Led and Backlight Module Using the Same
Application:
13/273,470 →
Publication:
US 2012/0113621
LED Linear Regulator Circuit with Improved Power Factor
Omnidirectional Reflector
Light-Emitting Diode with Textured Substrate
Method of providing a semiconductor structure with one or more through-holes and a semiconductor structure comprising one or more through-holes
Application:
60/329,699 →
Optical device receiving substrate and optical device holding carrier
Application:
60/380,287 →
Accurate positioning of components of an optical assembly
Application:
60/395,196 →
Assembly for opto-electronic or other components using self-aligned technique to connect a receptacle to a substrate that supports the component
Application:
60/565,217 →
Laser package
Application:
60/609,284 →
QFN/SON-compatible package
Application:
60/717,818 →
Formation of through-wafer electrical interconnections and other structures using a thin etch-stop membrane
Application:
60/848,043 →
Light Emitting Device Package
Application:
61/076,263 →
Conductive Feed-Through in Semiconductor Material
Application:
61/144,525 →
Opto-Electronic Device Package with a Semiconductor-Based Sub-Mount Having Smd Metal Contacts
Application:
61/152,382 →
LED Linear Regulator Circuit with Improved Power Factor
Application:
61/778,043 →
Method and apparatus for packaging phosphor-coated LEDs
Application:
61/783,610 →
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Merger
Dec 14, 2015
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037289/0265 →
Merger
Mar 26, 2016
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 038107/0930 →
Corrective Assignment to Correct the Assignee Name Previously Recorded at Reel: 017206 Frame: 0666. Assignor(S) Hereby Confirms the Assignment.
May 6, 2016
From: AGILENT TECHNOLOGIES, INC.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 038632/0662 →
Corrective Assignment to Correct the Name of the Assignee Previously Recorded on Reel 017207 Frame 0020. Assignor(S) Hereby Confirms the Assignment.
May 6, 2016
From: AGILENT TECHNOLOGIES, INC.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 038633/0001 →
Merger
Dec 6, 2017
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 044321/0336 →