IP Library › Patent Application 60329699
Patent Application Provisional
App. No. 60/329,699 · Confirmation No. 5716

Method of providing a semiconductor structure with one or more through-holes and a semiconductor structure comprising one or more through-holes

Inventor: Matthias Heschel
Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2001-10-17 TRNA Transmittal of New Application 1 View
2001-10-17 SPEC Specification 33 View
2001-10-17 CLM Claims 23 View
2001-10-17 DRW Drawings-only black and white line drawings 26 View
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Quick Facts
App. No.
60/329,699
Filed
2001-10-17