Patent Assignment
Reel/Frame 038107/0930
Merger
Recorded: 2016-03-26
Pages: 13
Assignor
CHIP STAR LTD.
Executed: 2015-07-15
Assignee
EPISTAR CORPORATION
5 LI HSIN 5TH RD., SCIENCE BASED INDUSTRIAL PARK, HSINCHU, TAIWAN
Covered Properties
(31)
Programmable Led Driver Pad
Patent:
6,266,000 →
Application:
09/303,797 →
Hybrid Integration of Active and Passive Optical Components on an Si-Board
Patent:
6,832,013 →
Application:
10/030,639 →
Encapsulated Optical Fiber End-Coupled Device
Semiconductor Structure with One or More Through-Holes
Optical Package with an Integrated Lens and Optical Assemblies Incorporating the Package
Package with a Light Emitting Device
Three-dimensional inductive micro components
Application:
10/699,981 →
Publication:
US 2005/0093667
Adjustable Spectrum Flash Lighting for Image Acquisition
Method and Apparatus for Producing Untainted White Light Using Off-White Light Emitting Diodes
Light Transmitting Modules with Optical Power Monitoring
Hermetically Sealed Package for Optical, Electronic, Opto-Electronic and Other Devices
A Method of Forming an Assembly to House One or More Micro Components
Semiconductor Structures Having Through-Holes Sealed with Feed-Through Metalization
Illumination Apparatus and Method
Light Source with Wavelength Converting Material
Method and Apparatus Using Liquid Crystal Light Valve to Filter Incident Light on a Photodetector
Device and Method for Emitting Output Light Using Quantum Dots and Non-Quantum Fluorescent Material
Device and Method for Providing Illuminating Light Using Quantum Dots
Flash Module with Quantum Dot Light Conversion
Light-Emitting Diode Flash Module with Enhanced Spectral Emission
Method of Fabricationg a Package for a Micro Component
Microelectromechanical systems (MEMS) devices integrated in a hermetically sealed package
Application:
11/144,429 →
Publication:
US 2005/0269688
Fabrication and Use of Polished Silicon Micro-Mirrors
Method of fabrication for chip scale package for a micro component
Optical Module Hermetically Packaged in Micro-Machined Structures
Sealed Package With Glass Window for Optoelectronic Components, and Assemblies Incorporating the Same
Application:
11/558,175 →
Publication:
US 2007/0120041
Accurate Positioning of Components of an Optical Assembly
Chip Scale Package For A Micro Component
Application:
12/143,003 →
Publication:
US 2008/0315390
Method of providing a semiconductor structure with one or more through-holes and a semiconductor structure comprising one or more through-holes
Application:
60/329,699 →
Assembly for opto-electronic or other components using self-aligned technique to connect a receptacle to a substrate that supports the component
Application:
60/565,217 →
Laser package
Application:
60/609,284 →
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 3, 2015
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
To: CHIP STAR LTD.
Reel/Frame 036543/0245 →
Corrective Assignment to Correct the Assignee Name Previously Recorded at Reel: 017206 Frame: 0666. Assignor(S) Hereby Confirms the Assignment.
May 6, 2016
From: AGILENT TECHNOLOGIES, INC.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 038632/0662 →
Corrective Assignment to Correct the Name of the Assignee Previously Recorded on Reel 017207 Frame 0020. Assignor(S) Hereby Confirms the Assignment.
May 6, 2016
From: AGILENT TECHNOLOGIES, INC.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 038633/0001 →
Assignment of Assignor's Interest
Dec 17, 2025
From: EPISTAR CORPORATION
To: TAU CETI VENTURES LLC
Reel/Frame 073969/0972 →