Method of forming an assembly to house one or more micro components
View Patent ↗Formation of a structure with through-holes includes attaching two sub-structures to one another. The resulting structure may be used in a sub-assembly for various types of micro components and may serve as a lid or base of a housing that encapsulates one or more micro components. The techniques may provide greater flexibility in the shape of the through-holes and may reduce costs compared with other known techniques.
1. A method of forming an assembly to house one or more micro components, the method comprising:
providing a first sub-structure having a first through-hole; and
attaching the first sub-structure to a second sub-structure having a group of one or more through-holes each of which is smaller than the first through-hole in the first sub-structure, wherein the group of smaller through-holes in the second sub-structure is positioned opposite the through-hole in the first sub-structure.
2. The method of claim 1 including providing feed-through metallization in at least one of the through-holes in the second sub-structure.
3. The method of claim 1 wherein the second sub-structure is at least several times thinner than the first sub-structure.
4. The method of claim 1 including using the structure comprising the first and second sub-structures as a lid of a housing that encapsulates the one or more micro components.
5. The method of claim 1 including using the structure comprising the first and second sub-structures as a base of a housing that encapsulates the one or more micro components.
6. The method of claim 1 including etching the first sub-structure to form the first through-hole therein.
7. The method of claim 6 wherein the etching includes a dry etching process.
8. The method of claim 6 wherein the etching includes an isotropic wet etching process.
9. The method of claim 6 wherein the etching includes an anisotropic wet etching process.
10. The method of claim 1 including molding the first sub-structure to form the first through-hole therein.
11. The method of claim 1 wherein the through-hole in the first sub-structure has concave sidewalls.
12. The method of claim 1 wherein the through-hole in the first sub- structure has slanted sidewalls.
13. A method of forming an assembly to house one or more micro components, the method comprising:
providing a first sub-structure having a first through-hole and
attaching the first sub-structure to a second sub-structure having a group of one or more through-holes each of which is smaller than the first through-hole in the first sub-structure, wherein the group of smaller through-holes in the second sub-structure is positioned opposite the through-hole in the first sub-structure when the first sub-structure is attached to the second sub-structure.
wherein forming the through-holes in the second sub-structure includes:
partially etching the second sub-structure to form grooves in a surface on a first side of the second sub-structure; and
thinning the second sub-structure from a side opposite the first side.
14. The method of claim 13 wherein thinning the second sub-structure includes using a chemical-mechanical polishing process.
15. The method of claim 13 including:
attaching the second sub-structure to a carrier substrate before performing the thinning of the second sub-structure; and
removing the carrier substrate from the second sub-structure after the first sub-structure is attached to the second sub-structure.
16. The method of claim 13 including attaching the first sub-structure to the second sub-structure after partially etching the second sub-structure to form the grooves, but before performing the thinning.
17. The method of claim 16 including providing feed-through metallization in at least one of the grooves in the second sub-structure before thinning the second sub-structure, wherein the thinning exposes the feed-through metallization.
18. A method of forming an assembly to house one or more micro components, the method comprising:
providing a first sub-structure having a first through-hole; and
attaching the first sub-structure to a second sub-structure having a group of one or more through-holes each of which is smaller than the first through-hole in the first sub-structure and each of which has a diameter less than ten microns, wherein the group of smaller through-holes in the second sub-structure is positioned opposite the through-hole in the first sub-structure.
19. A method of forming an assembly to house one or more micro components, the method comprising:
providing a first substantially planar sub-structure having a first through-hole;
attaching the first sub-structure to a second substantially planar sub-structure; and
subsequently forming a group of one or more through-holes in the second sub-structure, wherein each through-hole in the second sub-structure is smaller than the first through-hole in the first sub-structure, wherein the group of smaller through-holes in the second sub-structure is positioned opposite the through-hole in the first sub-structure.
20. The method of claim 19 including providing feed-through metallization in at least one of the through-holes in the second sub-structure.
21. The method of claim 19 wherein the second sub-structure is at least several times thinner than the first sub-structure.
22. The method of claim 19 including using the structure comprising the first and second sub-structures as a lid of a housing that encapsulates the one or more micro components.
23. The method of claim 19 including using the structure comprising the first and second sub-structures as a base of a housing that encapsulates the one or more micro components.
24. The method of claim 19 including etching the first sub-structure to form the first through-hole therein.
25. The method of claim 24 wherein the etching includes a dry etching process.
26. The method of claim 24 wherein the etching includes an isotropic wet etching process.
27. The method of claim 24 wherein the etching includes an anisotropic wet etching process.
28. The method of claim 19 wherein the through-hole in the first sub-structure has concave sidewalls.
29. The method of claim 19 wherein the through-hole in the first sub-structure has slanted sidewalls.