Patent Assignment
Reel/Frame 025403/0566
Assignment of Assignor's Interest
Recorded: 2010-11-30
Received: 2010-11-30
Pages: 14
Assignor
HYMITE A/S
Executed: 2010-08-09
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, TWX, 300-77, TAIWAN
Covered Properties
(40)
Formation of Through-Wafer Electrical Interconnections and Other Structures Using a Thin Dielectric Membrane
Application:
12/566,136 →
Semiconductor-Based Submount with Electrically Conductive Feed-Throughs
Application:
12/430,591 →
Formation of Through-Wafer Electrical Interconnections and Other Structures Using a Thin Dielectric Membrane
Application:
12/418,923 →
Silicon-Based Sub-Mount for an Opto-Electronic Device
Application:
12/369,993 →
Package for a Light Emitting Element
Application:
12/257,203 →
Fabrication of Compact Opto-Electronic Component Packages
Application:
12/236,182 →
Light Emitting Device Package
Application:
61/076,263 →
Chip Scale Package For A Micro Component
Application:
12/143,003 →
Optoelectronic Device Submount
Application:
12/026,113 →
Fabrication of Compact Semiconductor Packages
Application:
12/014,443 →
Accurate Positioning of Components of an Optical Assembly
Application:
11/685,494 →
Fabrication Process for Package with Light Emitting Device on a Sub-Mount
Application:
11/675,179 →
Formation of Through-Wafer Electrical Interconnections and Other Structures Using a Thin Dielectric Membrane
Application:
11/669,664 →
Spacers for Wafer Bonding
Application:
11/621,045 →
Light Transmitting Modules with Optical Power Monitoring
Application:
11/566,448 →
Sealed Package With Glass Window for Optoelectronic Components, and Assemblies Incorporating the Same
Application:
11/558,175 →
Qfn/Son Compatible Package with Smt Land Pads
Application:
11/521,828 →
Hermetically Sealed Package for Optical, Electronic, Opto-Electronic and Other Devices
Application:
11/501,139 →
Small form factor camera module with lens barrel and image sensor
Application:
11/471,414 →
Optical communication with wavelength separation
Application:
11/410,475 →
Package for a Light Emitting Element with Integrated Electrostatic Discharge Protection
Application:
11/336,094 →
Optical Module Hermetically Packaged in Micro-Machined Structures
Application:
11/225,758 →
Method of fabrication for chip scale package for a micro component
Application:
11/202,478 →
Fabrication and Use of Polished Silicon Micro-Mirrors
Application:
11/156,170 →
Microelectromechanical systems (MEMS) devices integrated in a hermetically sealed package
Application:
11/144,429 →
Method of Fabricationg a Package for a Micro Component
Application:
11/082,507 →
Assembly with Self-Alignment Features to Position a Cover on a Substrate That Supports a Micro Component
Application:
10/848,498 →
A Method of Forming an Assembly to House One or More Micro Components
Application:
10/833,428 →
Hermetically Sealed Package for Optical, Electronic, Opto-Electronic and Other Devices
Application:
10/792,529 →
Light Transmitting Modules with Optical Power Monitoring
Application:
10/777,583 →
Three-dimensional inductive micro components
Application:
10/699,981 →
Accurate Positioning of Components of an Optical Assembly
Application:
10/616,521 →
Optical Device Receiving Substrate and Optical Device Holding Carrier
Application:
10/437,543 →
Package with a Light Emitting Device
Application:
10/395,687 →
Optical Package with an Integrated Lens and Optical Assemblies Incorporating the Package
Application:
10/305,255 →
Semiconductor Structure with One or More Through-Holes
Application:
10/264,440 →
Encapsulated Optical Fiber End-Coupled Device
Application:
10/224,801 →
Accurate positioning of components of an optical assembly
Application:
60/395,196 →
Optical device receiving substrate and optical device holding carrier
Application:
60/380,287 →
Hybrid Integration of Active and Passive Optical Components on an Si-Board
Application:
10/030,639 →