Assembly with self-alignment features to position a cover on a substrate that supports a micro component

1. An assembly comprising:

a micro component;

a substrate with a front surface supporting the micro component, wherein the substrate includes an alignment slot in at least one of its side edges, and wherein the substrate includes metallization electrically coupled to the micro component and extending from the front surface of the substrate to its back surface via the alignment slot; and

a cover attached to the substrate so as to encapsulate the micro component, wherein the cover includes at least one protrusion on its underside such that each protrusion mates with a respective alignment slot in the substrate.

2. The apparatus of claim 1 including a respective alignment slot in each of two or more side edges of the substrate, wherein the cover includes corresponding protrusions each of which mates, respectively, with one of the alignment slots.

3. The apparatus of claim 1 including a respective alignment slot in each side edge of the substrate, wherein the cover includes corresponding protrusions each of which mates, respectively, with one of the alignment slots.

4. The apparatus of claim 3 wherein each alignment slot forms a slanted surface in a respective side-edge of the substrate.

5. The apparatus of claim 4 wherein each alignment slot slants outwardly from the front surface of the substrate to its back surface.

6. The apparatus of claim 3 wherein the metallization extending from the front surface of the substrate to its back surface includes conductive lines electrically coupled to the micro component.

7. The apparatus of claim 3 wherein the cover includes a recessed cavity, and wherein the micro component is located within an area defined by the cavity.

8. The apparatus of claim 3 wherein the cover comprises a plastic material.

9. The apparatus of claim 3 wherein the cover comprises an infra-red transparent polymer.

10. The apparatus of claim 3 wherein the micro component includes an optoelectronic device, and the cover comprises a material that is transparent to a wavelength of light emitted or detected by the optoelectronic device.

11. The apparatus of claim 3 wherein the cover comprises an injection-molded material.

12. The apparatus of claim 3 wherein the cover includes a molded optical lens.

13. An assembly comprising:

an optoelectronic device;

a substrate with a front surface supporting the optoelectronic device, wherein the substrate includes a respective alignment slot in each of its side edges, wherein each alignment slot has a surface that slants outwardly from the front surface of the substrate to its back surface, and wherein the substrate includes metallization electrically coupled to the optoelectronic device and extending from the front surface of the substrate to its back surface via the alignment slots; and

a cover attached to the substrate so as to encapsulate the optoelectronic device, wherein the cover includes protrusions on its underside such that each protrusion mates with a respective alignment slot in the substrate, and wherein the cover comprises a material that is transparent to a wavelength of light emitted or detected by the optoelectronic device.

14. The apparatus of claim 13 wherein the cover comprises a plastic material.

15. The apparatus of claim 13 wherein the cover comprises an infra-red transparent polymer.

16. The apparatus of claim 13 wherein the cover comprises an injection-molded material.

17. The apparatus of claim 13 wherein the cover includes a molded optical lens.