Patent Assignment
Reel/Frame 037289/0265
Merger
Recorded: 2015-12-14
Pages: 5
Assignor
CHIP STAR LTD.
Executed: 2015-07-15
Assignee
EPISTAR CORPORATION
5 LI HSIN 5TH RD., SCIENCE BASED INDUSTRIAL PARK, HSINCHU, TAIWAN
Covered Properties
(9)
Optical Device Receiving Substrate and Optical Device Holding Carrier
Accurate Positioning of Components of an Optical Assembly
Assembly with Self-Alignment Features to Position a Cover on a Substrate That Supports a Micro Component
Light Transmitting Modules with Optical Power Monitoring
Semiconductor-Based Submount with Electrically Conductive Feed-Throughs
Application:
12/430,591 →
Publication:
US 2010/0176507
Light Emitting Diode Package with Photoresist Reflector and Method of Manufacturing
Application:
13/178,108 →
Publication:
US 2012/0098006
LED Linear Regulator Circuit with Improved Power Factor
Light-Emitting Diode with Textured Substrate
Optical device receiving substrate and optical device holding carrier
Application:
60/380,287 →
Related Assignments
(3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 5, 2014
From: YU, CHEN-HUA; CHIOU, WEN-CHIH; CHEN, DING-YUAN; YU, CHIA-LIN
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 033462/0421 →
Assignment of Assignor's Interest
Sep 3, 2015
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
To: CHIP STAR LTD.
Reel/Frame 036543/0245 →
Change of Name
Apr 22, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075513/0783 →