IP Library Granted Patent US 9,130,115
Granted Patent B2
US 9,130,115 · App. 14/187,438 · Granted Sep 8, 2015

Light-emitting diode with textured substrate

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Quick Facts
Patent No.
US 9,130,115
App. No.
14/187,438
Granted
Sep 8, 2015
Kind
B2
Abstract

A light-emitting diode (LED) device is provided. The LED device has raised semiconductor regions formed on a substrate. LED structures are formed over the raised semiconductor regions such that bottom contact layers and active layers of the LED device are conformal layers. The top contact layer has a planar surface. In an embodiment, the top contact layers are continuous over a plurality of the raised semiconductor regions while the bottom contact layers and the active layers are discontinuous between adjacent raised semiconductor regions.

Claims (41)

1. An apparatus, comprising:

a substrate;

a patterned dielectric mask layer disposed over the substrate, wherein the patterned dielectric mask layer defines a plurality of openings;

a plurality of raised regions disposed over the substrate and within the openings, wherein the raised regions each have a non-planar upper surface;

a plurality of III-N compound components that are each disposed over the non-planar upper surface of a respective one of the raised regions, wherein the III-N compound components each have a first type of conductivity;

a plurality of multiple-quantum well (MQW) components that are each disposed over a respective one of the III-N compound components; and

a III-N compound layer disposed over the MQW components and over the patterned dielectric mask layer, wherein the III-N compound layer has a second type of conductivity different from the first type.

2. The apparatus of claim 1 , wherein: the substrate has a (100) surface orientation; and the raised regions disposed within the openings each have a (111) surface orientation.

3. The apparatus of claim 1 , wherein the non-planar upper surface is shaped as a pyramid or as a trapezoid.

4. The apparatus of claim 1 , wherein: the plurality of the III-N compounds and the plurality of the MQW components each have a non-planar upper surface; and the III-N compound layer is a continuous layer and has a planar upper surface.

5. An apparatus, comprising:

a substrate;

a mask layer over the substrate, wherein the mask layer includes a plurality of openings;

a plurality of raised regions disposed over the substrate, wherein the raised regions are each disposed within a respective one of the openings in a manner such that they prevent the substrate from being exposed;

a first contact layer including a plurality of components that are each disposed over a respective one of the raised regions, wherein the first contact layer has a first type of conductivity;

a light-emitting active layer including a plurality of components that are each disposed over a respective one of the components of the first contact layer; and

a second contact layer disposed over the light-emitting active layer and over the mask layer, wherein the second contact layer has a second type of conductivity different from the first type.

6. The apparatus of claim 5 , wherein:

the substrate has a (100) surface orientation; and

the raised regions each have a (111) surface orientation.

7. The apparatus of claim 5 , wherein the mask layer contains a dielectric material.

8. The apparatus of claim 5 , wherein the raised regions each have a pyramidal shape or a trapezoidal shape.

9. The apparatus of claim 5 , wherein:

the first contact layer and the second contact layer each contain a respective group III-N compound; and

the light-emitting active layer contains multiple quantum wells (MQW).

10. The apparatus of claim 5 , wherein the components of the first contact layer and the components of the light-emitting active layer each have a non-planar surface.

11. The apparatus of claim 5 , wherein the second contact layer is a continuous layer and has a planar surface.

12. The apparatus of claim 5 , wherein the components of the first contact layer and the components of the light-emitting active layer each are conformal to an upper surface of a respective one of the raised regions.

13. An apparatus, comprising:

a substrate;

a raised region over the substrate and providing a first surface that is non-planar;

a first contact layer over the first surface, wherein the first contact layer has a first type of conductivity;

a light-emitting active layer over the first contact layer; and

a second contact layer over the light-emitting active layer, wherein the second contact layer has a second type of conductivity different from the first type, and the second contact layer has a non-planar surface adjacent the light-emitting active layer and a planar surface opposite the non-planar surface.

14. The apparatus of claim 13 , further comprising a dielectric layer over the substrate and surrounding the raised region.

15. The apparatus of claim 13 , wherein the substrate includes silicon and the raised region includes silicon.

16. The apparatus of claim 13 , wherein the substrate has a (100) surface orientation and the raised region has a (111) surface orientation.

17. The apparatus of claim 13 , wherein the first surface is shaped as a pyramid or as a trapezoid.

18. The apparatus of claim 13 , wherein the first contact layer and the second contact layer each contain a respective group III-N compound.

19. The apparatus of claim 13 , wherein the light-emitting active layer contains multiple quantum wells (MQW).

20. The apparatus of claim 13 , wherein the first contact layer and the light-emitting active layer each are conformal to the first surface.

Assignments (4)
CHANGE OF NAME Recorded Apr 22, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075513/0783 →
MERGER Recorded Dec 14, 2015
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037289/0265 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 3, 2015
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
To: CHIP STAR LTD.
Reel/Frame 036543/0245 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 5, 2014
From: YU, CHEN-HUA; CHIOU, WEN-CHIH; CHEN, DING-YUAN; YU, CHIA-LIN; LIN, HUNG-TA
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 033462/0421 →