Patent Assignment
Reel/Frame 015263/0309
Assignment of Assignor's Interest
Recorded: 2004-10-19
Pages: 3
Assignee
HYMITE A/S
DTU, BLDG. 325, 1ST FLOOR, DK-2800 KGS. LYNGBY, DENMARK
Covered Property
(1)
Assembly with Self-Alignment Features to Position a Cover on a Substrate That Supports a Micro Component
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 30, 2010
From: HYMITE A/S
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 025403/0566 →
Assignment of Assignor's Interest
Sep 3, 2015
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
To: CHIP STAR LTD.
Reel/Frame 036543/0245 →
Merger
Dec 14, 2015
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037289/0265 →