Hermetically sealed package for optical, electronic, opto-electronic and other devices
View Patent ↗Techniques are disclosed for hermetically sealing one or more devices within a package. According to one aspect, a lid is attached to a substrate on which one or more devices are provided such that the devices are encapsulated within an area defined by the substrate and the lid. A substance, such as a lubricant or gas, is introduced via one or more through-holes in the lid to a region that is separated from the devices by a wall having at least one opening through which the substance can pass to the devices. The through-hole then may be hermetically sealed, for example, using a local heating process that does not degrade the lubricant or other substance.
1. A hermetically sealed package comprising:
one or more devices on a semiconductor substrate;
a lid attached to the semiconductor substrate to encapsulate the one or more devices such that the one or more devices are hermetically sealed within an area defined by the substrate and the lid;
wherein the lid includes:
a region containing a substance;
a wall separating the region containing the substance from the one or more devices, wherein the wall has an opening through which the substance can pass to the one or more devices.
2. The package of claim 1 wherein the lid includes a material that provides a seal for a hole in the lid through which the substance was introduced into the package.
3. The package of claim 1 wherein the lid includes a material that hermetically seals a hole in the lid through which the substance was introduced into the package.
4. The package of claim 1 wherein the substrate includes an electrical contact from the exterior of the package to the one or more devices encapsulated within the package.
5. The package of claim 1 wherein the substance comprises a lubricant.
6. The package of claim 1 wherein the substance comprises a lubricant to reduce wear of the one or more devices.
7. The package of claim 1 wherein the substance comprises a fluid.
8. The package of claim 1 wherein the one or more devices include semiconductor devices.
9. The package of claim 1 wherein the one or more devices comprise an array of devices.
10. The package of claim 1 wherein the one or more devices comprise at least one MEMS device.
11. The package of claim 1 wherein the lid is transparent to optical signals with which the one or more devices interact during their operation.
12. The package of claim 1 wherein the substrate is attached to the lid by a solder seal ring.
13. The package of claim 1 wherein the substance comprises a lubricant that can pass by evaporation through the opening in the wall to the one or more devices.
14. The package of claim 13 wherein the wall has a plurality of openings through which the lubricant can pass to the one or more devices.
15. The package of claim 13 wherein the region containing the substance is defined by walls attached to the lid.
16. The package of claim 15 wherein the opening is located higher than the bottom of the region containing the substance.
17. A hermetically sealed package comprising:
one or more devices on a substrate;
a lid attached to the substrate to encapsulate the one or more devices such that the one or more devices are hermetically sealed within an area defined by the substrate and the lid;
wherein the lid is transparent to optical signals with which the one or more devices are arranged to interact during their operation and wherein the lid includes:
a region containing a substance;
a wall separating the region containing the substance from the one or more devices, wherein the wall has an opening through which the substance can pass to the one or more devices.
18. The package of claim 17 wherein the lid comprises glass.
19. The package of claim 17 wherein the one or more devices comprise one or more semiconductor devices.
20. The package of claim 19 wherein the substance comprises a lubricant that can pass by evaporation to the one or more devices.