Patent Assignment
Reel/Frame 037457/0645
Merger
Recorded: 2015-12-14
Pages: 13
Assignor
CHIP STAR LTD.
Executed: 2015-07-15
Assignee
EPISTAR CORPORATION
5 LI HSIN 5TH RD., SCIENCE BASED INDUSTRIAL PARK, HSINCHU, TAIWAN
Covered Properties
(10)
Semiconductor Structure with One or More Through-Holes
Method and Apparatus for Producing Untainted White Light Using Off-White Emitting Diodes
Hermetically Sealed Package for Optical, Electronic, Opto-Electronic and Other Devices
Gallium Nitride Device Substrate Containing a Lattice Parameter Altering Element
Semiconductor-Based Sub-Mounts for Optoelectronic Devices with Conductive Paths
Fabrication of Compact Opto-Electronic Component Packages
Light-Emitting Diode Integration Scheme
Omnidirectional Reflector
QFN/SON-compatible package
Application:
60/717,818 →
Opto-Electronic Device Package with a Semiconductor-Based Sub-Mount Having Smd Metal Contacts
Application:
61/152,382 →
Related Assignments
(7)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 11, 2012
From: GREISEN, CHRISTOFFER G.
To: HYMITE A/S
Reel/Frame 028352/0604 →
Assignment of Assignor's Interest
Jun 11, 2012
From: HYMITE A/S
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 028352/0658 →
Assignment of Assignor's Interest
Nov 7, 2013
From: CHEN, DING-YUAN; YU, CHEN-HUA; CHIOU, WEN-CHIH
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 031559/0310 →
Assignment of Assignor's Interest
Apr 15, 2015
From: CHEN, DING-YUAN; CHIOU, WEN-CHIH; YU, CHEN-HUA
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 035416/0859 →
Assignment of Assignor's Interest
Sep 3, 2015
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
To: CHIP STAR LTD.
Reel/Frame 036543/0245 →
Assignment of Assignor's Interest
Dec 17, 2025
From: EPISTAR CORPORATION
To: TAU CETI VENTURES LLC
Reel/Frame 073969/0972 →
Change of Name
Apr 22, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075513/0783 →