IP Library Granted Patent US 8,039,869
Granted Patent B2
US 8,039,869 · App. 11/838,467 · Granted Oct 18, 2011

Gallium nitride device substrate containing a lattice parameter altering element

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Quick Facts
Patent No.
US 8,039,869
App. No.
11/838,467
Granted
Oct 18, 2011
Kind
B2
Abstract

A gallium nitride device substrate comprises a layer of gallium nitride containing an additional lattice parameter altering element located over a substitute substrate.

Claims (9)

1. A gallium nitride device substrate, comprising a first layer of gallium nitride containing a first concentration of indium located over a substitute substrate, where the first concentration of indium causes strain in the first layer of gallium nitride containing the first concentration of indium so that a lattice parameter of the first layer of gallium nitride containing the first concentration of indium conforms to a lattice parameter of an underlying layer of gallium nitride, and where absence of a sacrificial substrate and the underlying layer of gallium nitride results in a strain relieved first layer of gallium nitride containing the first concentration of indium that forms a surface of the gallium nitride device substrate in which the first layer of gallium nitride containing a first concentration of indium has a composition of In x Ga 1-x N, where 0.1≦x≦0.5.

2. The substrate of claim 1 , in which the first layer of gallium nitride containing a first concentration of indium has a composition of In 0.1 Ga 0.9 N.

3. A gallium nitride device substrate, comprising:

a first layer of gallium nitride containing a first concentration of indium located over a substitute substrate, where the first concentration of indium causes strain in the first layer of gallium nitride containing the first concentration of indium so that a lattice parameter of the first layer of gallium nitride containing the first concentration of indium conforms to a lattice parameter of an underlying layer of gallium nitride, and where absence of a sacrificial substrate and the underlying layer of gallium nitride results in a strain relieved first layer of gallium nitride containing the first concentration of indium that forms a surface of the gallium nitride device substrate; and

a second layer of gallium nitride containing a second concentration of indium located over the first layer of gallium nitride containing the first concentration of indium, the second concentration of indium higher than the first concentration of indium.

4. The substrate of claim 3 , in which the first layer of gallium nitride containing a first concentration of indium has a composition of In x Ga 1-x N, where 0.1≦x≦0.5.

5. The substrate of claim 3 , in which the second layer of gallium nitride containing a second concentration of indium has a composition of In x Ga 1-x N, where 0.1≦x≦0.5.

6. The substrate of claim 3 , in which the first layer of gallium nitride containing a first concentration of indium has a composition of In 0.1 Ga 0.9 N.

7. The substrate of claim 3 , in which the second layer of gallium nitride containing the second concentration of indium has a composition of In 0.2 Ga 0.8 N.

Assignments (3)
MERGER Recorded Dec 14, 2015
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037457/0645 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 3, 2015
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
To: CHIP STAR LTD.
Reel/Frame 036543/0245 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 8, 2011
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.; AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD.
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 026875/0665 →