Fabrication of compact opto-electronic component packages
View Patent ↗A wafer-level method of fabricating an opto-electronic component package, in which the opto-electronic component is mounted to a semiconductor wafer having first and second surfaces on opposite sides of the wafer. The method includes etching vias in the first surface of the semiconductor wafer. The first surface and surfaces in the vias are metallized, and the metal is structured to define a thermal pad and to define the anode and cathode contact pads. A carrier wafer is attached on the side of the semiconductor wafer having the first surface, and the semiconductor wafer is thinned from its second surface to expose the metallization in the vias. Metal is provided on the second surface, and the metal is structured to define a die attach pad and additional anode and cathode pads for the opto-electronic component. The opto-electronic component is mounted on the die attach pad and a protective cover is formed over the opto-electronic component.
1. An opto-electronic component package comprising:
a semiconductor wafer comprising first and second surfaces on opposite sides of the wafer, wherein a height of the semiconductor wafer is 100 μl to 400 μm;
vias extending through the wafer from the first surface to the second surface, with metallization over inner surfaces of the vias;
a thermal pad on the first surface of the wafer to transfer heat away from the opto-electronic component;
anode and cathode contact pads on the first surface of the wafer and electrically connected to the metallization in the vias;
a die attach pad on the second surface of the wafer;
an opto-electronic component mounted to the die attach pad;
anode and cathode pads on the second surface of the wafer and electrically connected to the opto-electronic component through the metallization in the vias; and
an optical component mounted to the second surface of the wafer and arranged to direct light from the opto-electronic component out of the package.
2. The opto-electronic component package of claim 1 further comprising electronic circuitry on the first surface of the wafer and electrically connected to the opto-electronic component.
3. The opto-electronic component package of claim 1 wherein the optical component is at least one of an optical reflector or a molded lens.
4. The opto-electronic component package of claim 1 further comprising a protective cover over the opto-electronic component, wherein the protective cover is transparent to a wavelength of light emitted by or received by the opto-electronic component.
5. The opto-electronic component package of claim 1 wherein the semiconductor wafer is thinned by mechanically grinding a surface of the semiconductor wafer and etching the semiconductor wafer.