Patent Assignment
Reel/Frame 037211/0130
Change of Name
Recorded: 2015-12-02
Pages: 14
Assignor
TSMC SOLID STATE LIGHTING LTD.
Executed: 2015-04-02
Assignee
CHIP STAR LTD.
NO. 9 LIXING 4TH RD., HSINCHU SCIENCE AND INDUSTRIAL PARK, HSINCHU CITY, TAIWAN
Covered Properties
(10)
Fabrication of Compact Opto-Electronic Component Packages
Light-Emitting Diode with Current-Spreading Region
Novel Semiconductor Package with Through Silicon Vias
Method and Structure for Led with Nano-Patterned Substrate
Package for a Light Emitting Element
Light Emitting Diode Optical Emitter with Transparent Electrical Connectors
Light-Emitting Diode with Textured Substrate
Light-Emitting Diode Lamp and Method of Making
LED Flip-Chip Package Structure with Dummy Bumps
Light Emitting Diode Light Bar Module with Electrical Connectors Formed by Injection Molding
Related Assignments
(12)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
May 4, 2012
From: YU, CHEN-HUA; CHIOU, WEN-CHIH; CHEN, DING-YUAN; YU, CHIA-LIN
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
Reel/Frame 028154/0472 →
Assignment of Assignor's Interest
May 4, 2012
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 028154/0532 →
Assignment of Assignor's Interest
May 17, 2012
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 028228/0483 →
Assignment of Assignor's Interest
Jul 25, 2012
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 028631/0308 →
Assignment of Assignor's Interest
Jul 25, 2012
From: LEE, HSIAO-WEN; SUN, CHIH-HSUAN; YEH, WEI-YU
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 028631/0281 →
Assignment of Assignor's Interest
Apr 16, 2015
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 035423/0423 →
Assignment of Assignor's Interest
Apr 16, 2015
From: MURPHY, THOMAS; HASE, ANDREAS A.; HESCHEL, MATTHIAS
To: HYMITE GMBH
Reel/Frame 035423/0253 →
Assignment of Assignor's Interest
Apr 16, 2015
From: HYMITE GMBH
To: HYMITE A/S
Reel/Frame 035423/0314 →
Assignment of Assignor's Interest
Apr 16, 2015
From: HYMITE A/S
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 035423/0386 →
Merger
Dec 2, 2015
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037196/0816 →
Assignment of Assignor's Interest
Dec 17, 2025
From: EPISTAR CORPORATION
To: TAU CETI VENTURES LLC
Reel/Frame 073969/0972 →
Change of Name
Apr 22, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075513/0783 →