IP Library › Assignment 028228/0483
Patent Assignment
Reel/Frame 028228/0483

Assignment of Assignor's Interest

Recorded: 2012-05-17 Pages: 3
Assignor
Assignee
TSMC SOLID STATE LIGHTING LTD.
9, LI-HSIN 4TH ROAD, HSINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Property (1)
LED Flip-Chip Package Structure with Dummy Bumps
Patent: 8,399,269 →
Application: 13/474,282 →
Publication: US 2012/0225509
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Dec 2, 2015
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037196/0816 →
Change of Name Dec 2, 2015
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037211/0130 →
Change of Name Apr 22, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075513/0783 →