IP Library › Assignment 028631/0308
Patent Assignment
Reel/Frame 028631/0308

Assignment of Assignor's Interest

Recorded: 2012-07-25 Pages: 3
Assignor
Assignee
TSMC SOLID STATE LIGHTING LTD.
9, LI-HSIN 4TH ROAD, HSINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Property (1)
Light Emitting Diode Light Bar Module with Electrical Connectors Formed by Injection Molding
Patent: 8,591,251 →
Application: 13/557,315 →
Publication: US 2012/0287635
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 25, 2012
From: LEE, HSIAO-WEN; SUN, CHIH-HSUAN; YEH, WEI-YU
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 028631/0281 →
Merger Dec 2, 2015
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037196/0816 →
Change of Name Dec 2, 2015
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037211/0130 →