IP Library Granted Patent US 6,856,717
Granted Patent B2
US 6,856,717 · App. 10/395,687 · Granted Feb 15, 2005

Package with a light emitting device

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Quick Facts
Patent No.
US 6,856,717
App. No.
10/395,687
Granted
Feb 15, 2005
Kind
B2
Abstract

A package includes a cap with a solid-state light emitting device mounted within a recess in the cap. A plate is attached to the cap to define a hermetically sealed region in which the light emitting device is housed, and a base is attached to the plate. The plate and base are transparent to a wavelength of light emitted by the light emitting device. An optical wavelength selective element is disposed between the plate and the base to select the wavelength of light to exit the package through the base.

Claims (41)

1. A package comprising:

a cap including a recess;

a solid-state light emitting device mounted within the recess;

a plate attached to the cap to define a sealed region in which the light emitting device is housed, wherein the plate is transparent to a wavelength of light emitted by the light emitting device;

a base attached to the plate wherein the base is transparent to said wavelength of light, wherein the plate is disposed in an area between the base and the cap such that light emitted by the light emitting device passes through the plate; and

an optical wavelength selective element, disposed between the plate and the base, to select said wavelength of light to exit the package through the base.

2. The package of claim 1 wherein the light emitting device includes an edge-emitting semiconductor device, and wherein the recess in the cap includes a sidewall with a reflective coating to redirect light emitted by the light emitting device toward the base.

3. The package of claim 1 wherein the wavelength selective element comprises an optical filter.

4. The package of claim 3 wherein the wavelength selective element comprises a thin film filter.

5. The package of claim 4 wherein the thin film filter comprises stacks of alternating high and low refractive index material layers.

6. The package of claim 3 wherein the wavelength selective element comprises a tunable filter.

7. The package of claim 1 wherein the wavelength selective element comprises an optical grating.

8. The package of claim 1 wherein the wavelength selective element comprises an etalon.

9. The package of claim 1 comprising a lens located outside the sealed region to receive light emitted by the light emitting device and to pass the light toward the wavelength selective element.

10. The package of claim 9 wherein the plate includes a recess in which the lens is mounted.

11. The package of claim 9 wherein the wavelength selective element is disposed within the recess in the plate.

12. The package of claim 1 wherein the plate includes a recess in which a lens is mounted.

13. The package of claim 1 wherein the wavelength selective element is positioned with respect to the base whereby, during operation, light that is emitted from the light emitting device and that is not selected by the wavelength selective element is not coupled back into the light emitting device.

14. The package of claim 1 wherein the base includes a partially reflecting surface to reflect a portion of the light that is emitted from the light emitting device and that is selected by the wavelength selective element to be coupled back into the light emitting device.

15. The package of claim 14 wherein the light emitting device includes a reflective surface that, in conjunction with the partially reflective surface of the base, forms a laser type cavity.

16. The package of claim 15 wherein the light emitting device includes an edge-emitting semiconductor device, and wherein the recess in the cap includes a sidewall with a reflective coating to redirect light emitted by the light emitting device toward the wavelength selective element.

17. The package of claim 15 wherein the partially reflecting surface is disposed on an outer surface of the base.

18. The package of claim 15 wherein the partially reflecting surface is disposed on a surface of the base near the plate.

19. The package of claim 1 comprising a collimating lens positioned outside the hermetically sealed region to receive light from the light emitting device and to pass the light to the wavelength selective element.

20. The package of claim 1 wherein an additional plate with a reflecting surface is provided to form an area between the base and the additional plate, and wherein, during operation, light that is emitted from the light emitting device and that is selected by the wavelength selective element is reflected back into the light emitting devices after passing through said area.

21. The package of claim 20 wherein the light emitting device includes a reflective surface that, in conjunction with a partially reflective surface of the base, forms a laser type cavity.

22. The package of claim 21 wherein the light emitting device includes an edge-emitting semiconductor device, and wherein the recess in the cap includes a sidewall with a reflective coating to redirect light emitted by the light emitting device toward the reflective surface on the additional plate.

23. The package of claim 21 wherein the base is anti reflection coated.

24. The package of claim 21 wherein the base has an opening through which light emitted from the light emitting device passes.

25. The package of claim 21 wherein the additional plate includes a surface that faces the base and that reflects all the light incident thereon.

26. The package of claim 21 wherein the additional plate includes a surface that reflects all the light incident thereon except light in a narrow wavelength band.

27. An apparatus comprising a package according to any one of claims 20 through 26 to detect a concentration of a light absorbing species in an area between the base and the additional plate.

28. The package of claim 1 including a reflective surface within the recess to redirect light emitted by the light emitting device toward the base.

29. An apparatus comprising:

a package according to any one of claims 1 - 19 and 28 ; and

an optical waveguide to receive the portion of light that exits the base.

30. The package of claim 28 including a lens through which light from the light emitting device passes before reaching the wavelength selective element.

31. The package of claim 30 wherein the plate is attached to the cap to define a hermetically sealed region in which the light emitting device is housed.

32. The package of claim 1 wherein the light emitting device is housed within a hermetically sealed area.

33. The package of claim 1 wherein the plate is attached to the cap to define a hermetically sealed region in which the light emitting device is housed.

34. The package of claim 1 including a lens through which light from the light emitting device passes before reaching the wavelength selective element.

Assignments (5)
MERGER Recorded Mar 26, 2016
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 038107/0930 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 3, 2015
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
To: CHIP STAR LTD.
Reel/Frame 036543/0245 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 30, 2010
From: HYMITE A/S
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 025403/0566 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 19, 2003
From: HYMITE GMBH
To: HYMITE A/S
Reel/Frame 014073/0704 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 21, 2003
From: KILIAN, ARND
To: HYMITE GMBH
Reel/Frame 013973/0868 →