Patent Assignment
Reel/Frame 026875/0305
Assignment of Assignor's Interest
Recorded: 2011-09-08
Received: 2011-09-08
Pages: 13
Assignor
HYMITE A/S
Executed: 2010-08-09
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, TWX, 300-77, TAIWAN
Covered Properties
(15)
Medical Module for Drug Delivery Pen
Application:
13/203,691 →
Drug Delivery System
Application:
13/203,694 →
Conductive Feed-Through in Semiconductor Material
Application:
61/144,525 →
Formation of through-wafer electrical interconnections and other structures using a thin etch-stop membrane
Application:
60/848,043 →
Sealed package with glass window for optoelectronic components, and assemblies incorporating the same
Application:
60/749,247 →
Sealed package with glass window for optoelectronic components, and assemblies incorporating the same
Application:
60/737,532 →
Sealed package with glass window for optoelectronic components
Application:
60/735,485 →
QFN/SON-compatible package
Application:
60/717,818 →
Microelectromechanical system (MEMS) component integrated in a hermetically sealed package
Application:
60/662,644 →
Semiconductor Structure with One or More Through-Holes
Application:
10/958,524 →
Laser package
Application:
60/609,284 →
Semiconductor Structures Having Through-Holes Sealed with Feed-Through Metalization
Application:
10/894,989 →
Microelectromechanical system (MEMS) component integrated in an hermetically sealed package
Application:
60/576,765 →
Assembly for opto-electronic or other components using self-aligned technique to connect a receptacle to a substrate that supports the component
Application:
60/565,217 →
Method of providing a semiconductor structure with one or more through-holes and a semiconductor structure comprising one or more through-holes
Application:
60/329,699 →