IP Library Patent Application 13273470
Patent Application
App. No. 13/273,470

BATWING BEAM BASED LED AND BACKLIGHT MODULE USING THE SAME

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Quick Facts
Patent No.
US None
App. No.
13/273,470
Abstract

A batwing beam is produced from an LED package having a primary LED lens by molding the LED lens directly over an LED on a package substrate. The LED lens includes a cavity over a center of the LED. The cavity surface reflects light from the LED through total internal reflection (TIR) or through a reflectivity gel coating. The cavity may be a cone or a pyramid.

Claims (46)

1 . An optical emitter comprising:

a Light-Emitting Diode (LED) die;

a package substrate attached to one side of the LED die;

electrical connections connecting the LED die and terminals on the package substrate; and

a molded lens bonded to the package substrate directly contacting the LED die, said molded lens having an ellipsoidal cross section with a batwing cavity centered over the LED die.

2 . The optical emitter of claim 1 , wherein the molded lens includes a high reflectivity coating on the cavity surface.

3 . The optical emitter of claim 2 , wherein the high reflectivity coating reflects at least 90% of incident light.

4 . The optical emitter of claim 2 , wherein the high reflectivity coating includes a metal.

5 . The optical emitter of claim 1 , wherein the cavity is a cone.

6 . The optical emitter of claim 5 , wherein the cavity has an aperture that causes the cavity surface to totally internally reflect light generated from a center of the LED.

7 . The optical emitter of claim 1 , wherein the cavity is an elliptical cone.

8 . The optical emitter of claim 1 , wherein the cavity is a pyramid.

9 . The optical emitter of claim 1 , wherein the molded lens is a silicone, a resin, an epoxy, or a poly(methyl methacrylate) (PMMA).

10 . The optical emitter of claim 1 , wherein the optical emitter is about or smaller than 3.5 mm by 3.5 mm.

11 . The optical emitter of claim 1 , wherein the molded lens base is a polygon with rounded corners.

12 . A method of fabricating an optical emitter, comprising:

attaching a Light-Emitting Diode (LED) die to a package substrate;

electrically connecting the LED die and the package substrate; and,

molding a lens over the package substrate and the LED die, wherein the molded lens includes a batwing cavity over the LED die.

13 . The method of claim 12 , wherein the molding a lens over the package substrate and the LED die comprises:

placing a lens mold over the package substrate and the LED die;

inserting a lens glue into the lens mold; and

curing a molded lens.

14 . The method of claim 13 , wherein the inserting a lens glue includes evacuating a space inside the lens mold.

15 . The method of claim 13 , wherein the curing a molded lens comprises exposing the lens glue to ultraviolet light through the lens mold or heating the lens glue.

16 . The method of claim 12 , further comprising dispensing a high reflectivity gel into the batwing cavity that completely coats the conical cavity surface.

17 . The method of claim 16 , wherein the high reflectivity gel comprises a metal.

18 . The method of claim 16 , wherein the metal is silver.

19 . The method of claim 12 , wherein the molded lens is a half ellipsoid with a conical portion removed from middle of the curved surface away from the LED die.

20 . The method of claim 12 , further comprising

molding a reflector on the package substrate around the LED die; and

dispensing a phosphor material in a volume formed by the molded reflector,

wherein molding a lens occurs after dispensing the phosphor material.

21 . The method of claim 12 , further comprising:

forming a phosphor component over the LED die before the molding a lens.

22 . A display comprising:

a plurality of optical emitters, each optical emitter comprising:

a Light-Emitting Diode (LED) die;

a package substrate attached to one side of the LED die;

electrical connections connecting the LED die and the package substrate; and

a molded lens bonded to the package substrate directly contacting the LED die, said molded lens having an ellipsoidal cross section with a batwing cavity centered over the LED die.

23 . An optical emitter comprising:

a plurality of Light-Emitting Diode (LED) dies;

a package substrate attached to one side of the plurality of LED dies;

electrical connections connecting the plurality of LED dies and terminals on the package substrate; and

a molded lens bonded to the package substrate directly contacting the plurality of LED dies, said molded lens having an ellipsoidal cross section with a batwing cavity.

Assignments (3)
MERGER Recorded Mar 26, 2016
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 038107/0949 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 3, 2015
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
To: CHIP STAR LTD.
Reel/Frame 036543/0245 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 27, 2011
From: LEE, HSIAO-WEN; TSENG, CHI-XIANG
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 027446/0790 →