IP Library Granted Patent US 9,748,456
Granted Patent B2
US 9,748,456 · App. 15/285,678 · Granted Aug 29, 2017

Light emitting structure and a manufacturing method thereof

Inventor: Chia-Liang Hsu (Hsinchu, TW)
Assignee: EPISTAR CORPORATION
H01L33/60H01L33/38H01L33/486H01L33/507H01L33/54H01L33/58H01L33/62H01L33/0079H01L2224/16H01L2933/0033H01L2933/0066
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Quick Facts
Patent No.
US 9,748,456
App. No.
15/285,678
Granted
Aug 29, 2017
Kind
B2
Abstract

A light-emitting structure comprises a semiconductor light-emitting element which includes a first connection point and a second connection point. The light-emitting structure further includes a first electrode electrically connected to the first connection point, and a second electrode electrically connected the second connection point. The first electrode and the second electrode can form a concave on which the semiconductor light-emitting element is located.

Claims (25)

1. A light-emitting structure, comprising:

a semiconductor light-emitting element comprising a first connection point and a second connection point;

a first electrode electrically connected to the first connection point, and comprising a topmost surface and a bottommost surface, wherein the topmost surface has a first end and a second end separated from the first end; and

a second electrode electrically connected to the second connection point,

wherein the first electrode comprises a solid conductive structure fully occupying a space between the topmost surface and the bottommost surface,

wherein the topmost surface comprises a curved surface, a beveled surface, or a combination thereof.

2. The light-emitting structure of claim 1 , further comprising a wavelength conversion layer, an encapsulation layer, or both thereof which are arranged on the semiconductor light-emitting element.

3. The light-emitting structure of claim 1 , further comprising a wavelength conversion layer which is conformably shaped to fit a portion of the semiconductor light-emitting element.

4. The light-emitting structure of claim 1 , further comprising a lens arranged on the semiconductor light-emitting element.

5. The light-emitting structure of claim 1 , further comprising a wavelength conversion layer which is arranged on the semiconductor light-emitting element, and has a top surface higher than the second end.

6. The light-emitting structure of claim 1 , wherein the first electrode and the second electrode are separated from each other by a groove.

7. The light-emitting structure of claim 6 , wherein first electrode has a portion higher than the groove.

8. The light-emitting structure of claim 6 , further comprising an insulating material filled in the groove.

9. The light-emitting structure of claim 6 , wherein the semiconductor light-emitting element is arranged above the groove.

10. The light-emitting structure of claim 1 , wherein the second end is higher than the first end in a cross sectional view.

11. The light-emitting structure of claim 1 , wherein the first electrode has an outer thickness, and an inner thickness which is smaller than the outer thickness.

12. The light-emitting structure of claim 1 , wherein the first electrode is a single solid structure.

13. The light-emitting structure of claim 1 , wherein the semiconductor light-emitting element is devoid of a growth substrate.

14. The light-emitting structure of claim 1 , wherein the first electrode comprises a portion not overlapping the semiconductor light-emitting element.

15. The light-emitting structure of claim 1 , wherein the first electrode comprises a first outermost end point, the second electrode comprises a second outermost end point, the first outermost end point and the second outermost end point are apart from each other by a distance which is greater than a maximum width of the semiconductor light-emitting element.

16. The light-emitting structure of claim 1 , further comprising a glue layer covering the semiconductor light-emitting element, the first electrode, and the second electrode.

17. The light-emitting structure of claim 1 , further comprising a glue layer arranged on first electrode and the second electrode in a configuration to expose a top surface of the semiconductor light-emitting element.

18. The light-emitting structure of claim 1 , further comprising a glue layer having a flat top surface which is substantially parallel to a top surface of the semiconductor light-emitting element.

19. The light-emitting structure of claim 1 , further comprising an insulating layer formed between the second electrode and the semiconductor light-emitting element.

20. The light-emitting structure of claim 1 , further comprising an insulating layer formed between the first electrode and the second electrode.

Assignments (3)
CHANGE OF NAME Recorded Feb 26, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075152/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 17, 2025
From: EPISTAR CORPORATION
To: TAU CETI VENTURES LLC
Reel/Frame 073969/0972 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 5, 2016
From: HSU, CHIA-LIANG
To: EPISTAR CORPORATION
Reel/Frame 039944/0325 →
Priority Claims (1)
TW 99130428 A · Sep 8, 2010 · national
Continuity (3)
Continuation 14536169 · Nov 7, 2014
Continuation 13227841 · Sep 8, 2011
Related Publication 20170025592A1 · Jan 26, 2017