IP Library Granted Patent US 9,484,498
Granted Patent B2
US 9,484,498 · App. 14/536,169 · Granted Nov 1, 2016

Light emitting structure having electrodes forming a concave surface and manufacturing method thereof

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Quick Facts
Patent No.
US 9,484,498
App. No.
14/536,169
Granted
Nov 1, 2016
Kind
B2
Abstract

A light-emitting structure comprises a semiconductor light-emitting element which includes a first connection point and a second connection point. The light-emitting structure further includes a first electrode electrically connected to the first connection point, and a second electrode electrically connected the second connection point. The first electrode and the second electrode can form a concave on which the semiconductor light-emitting element is located.

Claims (19)

1. A light-emitting structure, comprising:

a semiconductor light-emitting element comprising a sidewall, a first connection point, and a second connection point;

a glue layer covering the sidewall;

a first electrode electrically connected to the first connection point, and comprising a portion with a curved surface, a beveled surface, or a combination thereof; and

a second electrode electrically connected to the second connection point,

wherein the glue layer and the portion are overlapped with each other in a direction substantially parallel to the sidewall.

2. The light-emitting structure of claim 1 , further comprising a wavelength conversion layer, an encapsulation layer, or both thereof arranged on the semiconductor light-emitting element.

3. The light-emitting structure of claim 1 , wherein the semiconductor light-emitting element comprises a wavelength conversion layer being conformably shaped on the semiconductor light-emitting element.

4. The light-emitting structure of claim 1 , further comprising a lens arranged on the semiconductor light-emitting element, and a wavelength conversion layer formed between the lens and the semiconductor light-emitting element.

5. The light-emitting structure of claim 1 , wherein the first electrode and the second electrode are separated from each other by a groove.

6. The light-emitting structure of claim 5 , further comprising an insulating material filled in the groove.

7. The light-emitting structure of claim 1 , wherein the first electrode has an outer thickness and an inner thickness which is thinner than the outer thickness.

8. The light-emitting structure of claim 1 , further comprising a growth substrate for epitaxially growing the semiconductor light-emitting element, or a temporary substrate for supporting the semiconductor light-emitting element.

9. The light-emitting structure of claim 1 , wherein the semiconductor light-emitting element comprises a base.

10. The light-emitting structure of claim 1 , wherein the first electrode has a first side near the semiconductor light-emitting element, and a second side opposite to the first side, the portion locates at the first side.

11. The light-emitting structure of claim 1 , wherein the semiconductor light-emitting element is devoid of a growth substrate.

12. The light-emitting structure of claim 1 , wherein the first electrode comprises an edge far away from the semiconductor light-emitting element and not overlapping the semiconductor light-emitting element.

13. The light-emitting structure of claim 1 , wherein the first electrode comprises a first edge not overlapping the semiconductor light-emitting element, the second electrode comprises a second edge not overlapping the semiconductor light-emitting element, a distance between the first edge and the second edge is larger than a width of the semiconductor light-emitting element.

14. The light-emitting structure of claim 1 , further comprising a groove formed between the first electrode and the second electrode, wherein the first electrode has a portion higher than the groove.

Assignments (3)
CHANGE OF NAME Recorded Feb 26, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075152/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 17, 2025
From: EPISTAR CORPORATION
To: TAU CETI VENTURES LLC
Reel/Frame 073969/0972 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 17, 2015
From: HSU, CHIA-LIANG
To: EPISTAR CORPORATION
Reel/Frame 036593/0241 →