Light emitting device and method of forming the same
View Patent ↗A light emitting device includes a substrate and an adhesive layer on the substrate. At least two multi-layer epitaxial structures are on the substrate. Each structure sequentially includes an upper cladding layer, an active layer, a lower cladding layer, an ohmic contact epitaxial layer, and a first ohmic contact electrode adhered to the substrate by the adhesive layer. A second ohmic contact electrode is on the lower cladding layer. A channel divides the active layer into two portions. A first electrode is on the lower cladding layer corresponding to a first portion of the active layer. A second electrode is on the second ohmic contact electrode corresponding to a second portion of the active layer. A connection layer is formed in the structure so as to couple the first electrode with the first ohmic contact electrode. A dielectric layer is between these two structures. A conductive line couples the electrodes of these two structures.
1. A light emitting device, comprising:
a substrate;
an adhesive layer on said substrate;
at least two multi-layer epitaxial structures on said substrate, wherein each of said at least two multi-layer epitaxial structures comprises:
a light emitting structure having an upper cladding layer, an active layer, and a lower cladding layer;
an ohmic contact epitaxial layer on said upper cladding layer;
a first ohmic contact electrode on said ohmic contact epitaxial layer, the first ohmic contact electrode being adhered to said substrate by said adhesive layer;
a second ohmic contact electrode on said lower cladding layer;
a trench formed in said light emitting structure to separate said active layer into a first portion and a second portion;
a first electrode on said lower cladding layer corresponding to said first portion of said active layer;
a second electrode on said second ohmic contact electrode corresponding to said second portion of said active layer; and
a connection layer formed in said multi-layer epitaxial structure to couple said first electrode with said first ohmic contact electrode;
a dielectric layer separating said at least two multi-layer epitaxial structures into a first multi-layer epitaxial structure and a second multi-layer epitaxial structure; and
a conductive line coupling said first electrode of the first multi-layer epitaxial structure to said first electrode or said second electrode of the second multi-layer epitaxial structure.
2. The light emitting device according to claim 1 , wherein said substrate is selected from a group consisting of a glass substrate, a sapphire substrate, a SiC substrate, a GaP substrate, a GaAsP substrate, a ZnSe substrate, a ZnS substrate, and a ZnSSe substrate.
3. The light emitting device according to claim 1 , wherein said adhesive layer is selected from a group consisting of spin-on glass, silicone, BCB (Benzocyclobutene), epoxy, and polyimide.
4. The light emitting device according to claim 1 , wherein said active layer is selected from a group consisting of a homo-structure, a single hetero-structure (SH), a double hetero-structure (DH), and multiple quantum well (MQW).
5. The light emitting device according to claim 1 , wherein said first ohmic contact electrode is a p-type ohmic contact electrode, and said second ohmic contact electrode is an n-type ohmic contact electrode.
6. The light emitting device according to claim 1 , wherein said connection layer comprises a metal layer.
7. The light emitting device according to claim 1 , wherein said dielectric layer is selected from a group consisting of Al2O3, SiO2, SiNx, spin-on glass, silicone, BCB (Benzocyclobutene), epoxy, and polyimide.