IP Library Granted Patent US 9,557,046
Granted Patent B2
US 9,557,046 · App. 13/858,779 · Granted Jan 31, 2017

LED lamp and method of making the same

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Quick Facts
Patent No.
US 9,557,046
App. No.
13/858,779
Granted
Jan 31, 2017
Kind
B2
Abstract

A lighting device includes a multi-faceted heat sink with facets in a center portion facing outward. The facets form a central enclosed portion, and the heat sink further has a plurality of fins, where each of the fins is placed between adjacent facets and protrudes outwardly from the heat sink. The lighting device also has a plurality of circuit boards with semiconductor emitters mounted thereon. Each of the circuit boards is mounted on a respective facet of the heat sink. The lighting device also has a light-diffusion housing covering the plurality of circuit boards, a power module in communication with the circuit boards and operable to convert power to be compatible with the semiconductor emitters, and a power connector assembly in electrical communication with the power module.

Claims (25)

1. A lighting module comprising a heat sink, comprising a plurality of facets surrounding a central axis, the facts collectively defining a semi-enclosed space; and a plurality of fins disposed between the adjacent facets, wherein each of the fins is essentially consisted of two fin sub-structures and protrudes outwardly away from the central axis, and wherein the bottoms of the two fin sub-structures are connected to each other to form a groove parallel to the central axis to form a space providing for airflow and contacting with ambient air, and wherein for the two fin sub-structures, each fin increases in distance from each other as they extend from the central axis; and a plurality of light-emitting diodes (LEDs) disposed over each of the facets, wherein the LEDs are each configured to project light outwardly away from the central axis.

2. The lighting module of claim 1 , further comprising a plurality of circuit boards that are each mounted on a different one of the facets, wherein each circuit board has one or more of the LEDs disposed on it.

3. The lighting module of claim 1 , further comprising a plurality of diffuser caps each disposed over a different group of the LEDs, wherein the diffuser caps are not disposed over the airflow paths defined by the fins.

4. The lighting module of claim 3 , wherein the fins and the diffuser caps each have a curved sectional-view profile in a direction parallel to the central axis.

5. The lighting module of claim 4 , wherein the curved sectional-view profile conforms to a sectional-view profile of an A-lamp.

6. The lighting module of claim 1 , wherein the semi-enclosed space defined by the facets has a triangular top view profile or a polygonal top view profile.

7. The lighting module of claim 1 , wherein the semi-enclose space is filled with an electrically-isolating gel.

8. The lighting module of claim 1 , further comprising a power-conversion module disposed within the semi-enclosed space.

9. The lighting module of claim 1 , further comprising a plurality of diffuser caps, wherein each of the plurality of facets is disposed underneath a different one of the diffuser caps.

10. The lighting module of claim 1 , wherein the fins each has a non-flat contour.

11. The lighting module of claim 1 , wherein the heat sink including the plurality of facets and the plurality of fins is a one-piece structure.

12. The lighting module of claim 1 , wherein the profile of one of the fins is gradually narrow near the base and the top of the lighting module.

13. A lighting module, comprising:

a heat sink that includes a plurality of facets and a plurality of fins, wherein each facet faces a different direction and is directly connected to two fins, and wherein each fin is essentially consisting of two outwardly-protruding fin sub-structures, and wherein the bottoms of the two fin sub-structures are connected to each other to form a groove extending in a direction which is parallel to a central axis and along the fin sub-structure to form a space providing for airflow and contacting with ambient air, and wherein the two fin sub-structures of each fin increase in distance from each other as they extend from the central axis; and

a plurality of light-emitting diodes (LEDs) that are disposed over the facets, wherein the LEDs are each configured project light outwardly away from the central axis.

14. The lighting module of claim 13 , wherein the fine sub-structure has a curved side-view shape, and the curved side-view shape conforms to a side-view shape of an A-lamp.

15. The lighting module of claim 13 , further comprising: a plurality of diffuser caps that are each disposed over a respective subset of the LEDs, wherein each diffuser cap is coupled to a different subset of the fins.

16. The lighting module of claim 13 , further comprising: a plurality of circuit boards on which the LEDs are disposed, wherein each circuit board is disposed on a different one of the facets.

17. The lighting module of claim 13 , wherein:

the facets are circumferentially disposed around an elongate axis;

the fins each protrude outwardly away from the elongate axis; and

the LEDs are each configured to project light away from the elongate axis.

18. The lighting module of claim 17 , wherein the facets collectively define an semi-enclosed space through which the elongate axis extends, the semi-enclosed space having a triangular top view profile or a polygonal top view profile.

19. The lighting module of claim 13 , wherein the heat sink including the plurality of facets and the plurality of fins is a one-piece structure.

20. The lighting module of claim 13 , wherein the profile of one of the fins is gradually narrow near the base and the top of the lighting module.

Assignments (6)
CHANGE OF NAME Recorded Apr 22, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075513/0783 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 17, 2025
From: EPISTAR CORPORATION
To: TAU CETI VENTURES LLC
Reel/Frame 073969/0972 →
CHANGE OF NAME Recorded Nov 18, 2015
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037146/0102 →
MERGER Recorded Nov 18, 2015
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037146/0116 →
CORRECTIVE ASSIGNMENT TO CORRECT THE WRONG ASSIGNMENT WITH DIFFERENT TITLE AND INVENTORS WAS SUBMITTED ON 4/9/2013. PREVIOUSLY RECORDED ON REEL 030176 FRAME 0774. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Sep 24, 2013
From: SUN, CHIH-HSUAN; YEH, WEI-YU; LIN, TIEN-MING
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 031267/0658 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 9, 2013
From: YU, CHIH-KUANG; CHERN, CHYI SHYUAN; HSIA, HSING-KUO; KUO, HUNG-YI
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 030176/0774 →