IP Library › Assignment 037195/0724
Patent Assignment
Reel/Frame 037195/0724

Change of Name

Recorded: 2015-12-02 Pages: 14
Assignor
TSMC SOLID STATE LIGHTING LTD.
Executed: 2015-04-02
Assignee
CHIP STAR LTD.
NO. 9 LIXING 4TH RD., HSINCHU SCIENCE AND INDUSTRIAL PARK, HSINCHU CITY, TAIWAN
Covered Properties (9)
Omnidirectional Reflector
Patent: 8,415,691 →
Application: 12/202,167 →
Publication: US 2010/0038659
Light Emitting Diode Emitter Substrate with Highly Reflective Metal Bonding
Patent: 9,099,632 →
Application: 13/476,167 →
Publication: US 2012/0228650
Method of Separating Light-Emitting Diode from a Growth Substrate
Patent: 8,486,730 →
Application: 13/567,734 →
Publication: US 2012/0298956
LED Device with Embedded Top Electrode
Application: 13/631,590 →
Publication: US 2013/0082296
Omnidirectional Reflector
Patent: 8,609,448 →
Application: 13/857,678 →
Publication: US 2013/0224892
Forming Light-Emitting Diodes Using Seed Particles
Patent: 9,065,015 →
Application: 14/038,881 →
Publication: US 2014/0021483
Led Structure
Patent: 8,809,899 →
Application: 14/082,663 →
Publication: US 2014/0061688
Wafer Level Photonic Device Die Structure and Method of Making the Same
Patent: 9,224,932 →
Application: 14/096,420 →
Publication: US 2014/0084244
Light Emitting Devices with Textured Active Layer
Patent: 9,153,739 →
Application: 14/210,522 →
Publication: US 2014/0191191
Related Assignments (13)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest May 21, 2012
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 028239/0707 →
Assignment of Assignor's Interest Sep 27, 2013
From: CHU, JUNG-TANG; CHIU, CHING-HUA; HUANG, HUNG-WEN; LEE, YEA-CHEN
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 031295/0226 →
Assignment of Assignor's Interest Oct 9, 2013
From: CHEN, DING-YUAN; YU, CHEN-HUA; CHIOU, WEN-CHIH
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 031369/0208 →
Assignment of Assignor's Interest Dec 4, 2013
From: YU, CHIH-KUANG; KUO, HUNG-YI
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 031714/0122 →
Assignment of Assignor's Interest May 7, 2014
From: HUANG, HSIN-CHIEH
To: TSMC SOLID STATE LIGHTING, LTD.
Reel/Frame 032840/0044 →
Assignment of Assignor's Interest Jul 8, 2014
From: HSIA, SHOULI STEVE; YU, CHIH-KUANG; FU, KEN WEN-CHIEN; KUO, HUNG-YI
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 033257/0189 →
Assignment of Assignor's Interest Apr 15, 2015
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 035415/0323 →
Assignment of Assignor's Interest Apr 15, 2015
From: YU, CHEN-HUA; CHEN, DING-YUAN; CHIOU, WEN-CHIH
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 035413/0301 →
Assignment of Assignor's Interest Apr 15, 2015
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 035413/0322 →
Assignment of Assignor's Interest Apr 15, 2015
From: CHEN, DING-YUAN; LIN, HUNG-TA; YU, CHEN-HUA; CHIOU, WEN-CHIH
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 035415/0243 →
Merger Dec 2, 2015
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037195/0738 →
Assignment of Assignor's Interest Dec 17, 2025
From: EPISTAR CORPORATION
To: TAU CETI VENTURES LLC
Reel/Frame 073969/0972 →
Change of Name Apr 22, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075513/0783 →