Patent Assignment
Reel/Frame 031714/0122
Assignment of Assignor's Interest
Recorded: 2013-12-04
Pages: 3
Assignee
TSMC SOLID STATE LIGHTING LTD.
9, LI-HSIN 4TH ROAD, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Wafer Level Photonic Device Die Structure and Method of Making the Same
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Dec 2, 2015
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037195/0724 →
Merger
Dec 2, 2015
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037195/0738 →
Assignment of Assignor's Interest
Dec 17, 2025
From: EPISTAR CORPORATION
To: TAU CETI VENTURES LLC
Reel/Frame 073969/0972 →
Change of Name
Apr 22, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075513/0783 →