Patent Assignment
Reel/Frame 031295/0226
Assignment of Assignor's Interest
Recorded: 2013-09-27
Pages: 5
Assignors
CHU, JUNG-TANG
Executed: 2013-09-24
CHIU, CHING-HUA
Executed: 2013-09-23
HUANG, HUNG-WEN
Executed: 2013-09-23
LEE, YEA-CHEN
Executed: 2013-09-23
HSIA, HSING-KUO
Executed: 2013-09-23
Assignee
TSMC SOLID STATE LIGHTING LTD.
9, LI-HSIN 4TH ROAD, HSINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Property
(1)
Forming Light-Emitting Diodes Using Seed Particles
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Dec 2, 2015
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037195/0724 →
Merger
Dec 2, 2015
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037195/0738 →
Change of Name
Apr 22, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075513/0783 →