Patent Assignment
Reel/Frame 038263/0076
Change of Name
Recorded: 2016-03-26
Pages: 15
Assignor
TSMC SOLID STATE LIGHTING LTD.
Executed: 2015-04-02
Assignee
CHIP STAR LTD.
NO. 9, LIXING 4TH RD., HSINCHU SCIENCE AND INDUSTRIAL PARK, HSINCHU CITY, TAIWAN
Covered Properties
(15)
Package for a Light Emitting Element
Method of Light Emitting Diode Sidewall Passivation
Application:
12/851,696 →
Publication:
US 2012/0032212
Led Device with Improved Thermal Performance
Method and System for Adjusting Light Output from a Light Source
Application:
13/084,701 →
Publication:
US 2012/0105402
Modulized Full Operation Junction Ultra High Voltage (UHV) Device
Application:
13/153,087 →
Publication:
US 2012/0306391
Forming Light-Emitting Diodes Using Seed Particles
Cost-Effective Led Lighting Instrument with Good Light Output Uniformity
Growing an Improved P-Gan Layer of an Led Through Pressure Ramping
Light-Emitting Diode (LED) Package Systems
Wafer Level Reflector for LED Packaging
Led with Ic Integrated Lighting Module
Method and Apparatus for Packaging Phosphor-Coated Leds
Micro-Interconnects for Light-Emitting Diodes
Application:
14/180,390 →
Publication:
US 2014/0159096
Led Lamp with Remote Phosphor on a Cap Structure
Lighting Apparatus Having Improved Light Output Uniformity and Thermal Dissipation
Related Assignments
(11)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 15, 2013
From: KU, HAO-WEI; WANG, CHUNG YU; TANG, YU-SHENG; CHEN, HSIN-HUNG
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 030796/0329 →
Assignment of Assignor's Interest
Jul 15, 2013
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 030796/0370 →
Assignment of Assignor's Interest
Jul 31, 2013
From: LIN, CHIH-CHIA; HSIA, HSING-KUO; CHEN, CHING-HUI; TARN, JACOB C.
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 030913/0791 →
Assignment of Assignor's Interest
Dec 26, 2013
From: TSENG, CHI-XIANG; LEE, HSIAO-WEN; WU, MIN-SHENG; LIN, TIEN-MIN
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 031849/0588 →
Assignment of Assignor's Interest
Apr 29, 2014
From: HSIA, HSING-KUO; YU, CHIH-KUANG
To: TSMC SOLID STATE LIGHTING, LTD.
Reel/Frame 032776/0475 →
Security Interest
Dec 30, 2014
From: SCVNGR, INC.
To: BRIDGE BANK, NATIONAL ASSOCIATION
Reel/Frame 034604/0149 →
Assignment of Assignor's Interest
Jan 16, 2015
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 034733/0494 →
Assignment of Assignor's Interest
Jan 16, 2015
From: KO, PEI-WEN; YEH, WEI-YU
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 034733/0439 →
Merger
Mar 26, 2016
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 038107/0962 →
Assignment of Assignor's Interest
Dec 17, 2025
From: EPISTAR CORPORATION
To: TAU CETI VENTURES LLC
Reel/Frame 073969/0972 →
Change of Name
Apr 22, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075513/0783 →