Patent Assignment
Reel/Frame 032776/0475
Assignment of Assignor's Interest
Recorded: 2014-04-29
Pages: 5
Assignee
TSMC SOLID STATE LIGHTING, LTD.
9, LI-HSIN 4TH ROAD, HSHINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Property
(1)
Micro-Interconnects for Light-Emitting Diodes
Application:
14/180,390 →
Publication:
US 2014/0159096
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.