Light-emitting diode (LED) package systems

1. A method, comprising:

forming a plurality of thermally conductive structures in a first side of a substrate;

forming a plurality of polymer elements in the substrate along scribe lines of the substrate;

forming a plurality of cavities in a second side of the substrate different from the first side, the cavities exposing the thermally conductive structures from the second side;

placing a light-emitting diode (LED) in each of the cavities, the LED being thermally coupled to the thermally conductive structures; and

separating the LED from adjacent LEDs.

2. The method of claim 1 , wherein the separating the LED comprises performing a dicing process along each of the polymer elements.

3. The method of claim 1 , further comprising:

before the forming the plurality of cavities, attaching a carrier to the first side of the substrate; and

thinning the substrate from the second side after the carrier is attached; and

removing the carrier after the thinning of the substrate.

4. The method of claim 3 , wherein the carrier includes a glass material and is attached to the first side of the substrate through an adhesive material.

5. The method of claim 1 , further comprising: forming a lens material around the LED.

6. The method of claim 5 , wherein the LED includes a transparent substrate, and wherein the forming the lens material is performed such that a surface of the lens material is substantially level with a surface of the transparent substrate.

7. The method of claim 1 , wherein the LED has a plurality of solder bumps that are each coupled to a different one of the thermal conductive structures.

8. The method of claim 1 , further comprising: before the forming the cavities, forming a plurality of beveled grooves in the substrate from the second side such that tips of the grooves are level with bottom surfaces of the thermally conductive structures.

9. A method, comprising:

forming polymer materials in a substrate;

forming a plurality of thermally conductive structures in a first side of the substrate;

coupling a carrier to the first side of the substrate;

removing a portion of the substrate from a second side of the substrate opposite the first side;

thereafter forming a plurality of grooves in the second side of the substrate;

forming a plurality of cavities in the second side of the substrate, each of the cavities joining a different subset of the grooves and exposing a different subset of the thermally conductive structures from the second side;

disposing a plurality of light-emitting diodes (LEDs) in the cavities in a manner such that the LEDs are thermally coupled to the thermally conductive structures, wherein a respective LED is disposed in each of the cavities;

removing the carrier; and

performing a dicing process to singulate the LEDs.

10. The method of claim 9 , wherein the carrier includes a glass material.

11. The method of claim 9 , wherein the coupling the carrier is performed using an adhesive tape.

12. The method of claim 9 , wherein the forming the grooves is performed such that the grooves each have beveled surfaces.

13. The method of claim 9 , wherein the forming the grooves is performed such that a tip of at least one of the grooves is level with a bottom surface of at least one of the thermally conductive structures.

14. The method of claim 9 , further comprising: forming a lens material around each of the LEDs.

15. The method of claim 9 , wherein the LEDs each include a transparent substrate, and wherein the forming the lens material is performed such that a surface of the lens material is substantially co-planar with surfaces of the transparent substrates.

16. The method of claim 9 , wherein the dicing process is performed along the polymer materials.

17. A method, comprising:

forming a plurality of polymer element along scribe lines of a substrate;

forming a plurality of thermally conductive structures in the substrate, the thermally conductive structures being formed from a first side of the substrate and extend toward a second side of the substrate opposite the first side;

attaching a carrier to the second side of the substrate;

thereafter thinning the substrate from the second side;

forming a plurality of cavities in the substrate, the cavities being formed from the second side and exposing the thermally conductive structures to the second side;

disposing a plurality of light-emitting diodes (LEDs) in the cavities in a manner such that a respective LED is disposed in each of the cavities, wherein each LED includes a transparent substrate and a plurality of thermal conductive elements, and wherein the thermal conductive elements of the LEDs are each thermally coupled to a respective one of the thermally conductive structures formed in the substrate;

forming a lens material around each of the LEDs;

detaching the carrier from the substrate; and

dicing the polymer elements, thereby singulating the LEDs.

18. The method of claim 17 , further comprising: before the forming the plurality of cavities, forming a plurality of beveled grooves such that tips of the grooves are level with bottom surfaces of the thermally conductive structures.

19. The method of claim 17 , wherein the forming the lens material is performed such that a surface of the lens material is substantially co-planar with surfaces of the transparent substrates of the LEDs.