Patent Assignment
Reel/Frame 030796/0329
Assignment of Assignor's Interest
Recorded: 2013-07-15
Pages: 4
Assignors
KU, HAO-WEI
Executed: 2010-10-27
WANG, CHUNG YU
Executed: 2010-10-27
TANG, YU-SHENG
Executed: 2010-10-27
CHEN, HSIN-HUNG
Executed: 2010-10-27
YANG, HAO-YU
Executed: 2010-10-27
CHEN, CHING-YI
Executed: 2010-10-27
LEE, HSIAO-WEN
Executed: 2010-10-27
TSENG, CHI XIANG
Executed: 2010-10-27
GUO, SHENG-SHIN
Executed: 2010-10-27
LIN, TIEN-MING
Executed: 2010-10-27
TSAI, SHANG-YU
Executed: 2010-10-27
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Wafer Level Reflector for LED Packaging
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 15, 2013
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 030796/0370 →
Merger
Mar 26, 2016
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 038107/0962 →
Change of Name
Mar 26, 2016
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 038263/0076 →
Change of Name
Apr 22, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075513/0783 →