IP Library › Assignment 030796/0370
Patent Assignment
Reel/Frame 030796/0370

Assignment of Assignor's Interest

Recorded: 2013-07-15 Pages: 3
Assignor
Assignee
TSMC SOLID STATE LIGHTING LTD.
9, LI-HSIN 4TH ROAD, HSINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Property (1)
Wafer Level Reflector for LED Packaging
Patent: 9,343,505 →
Application: 13/941,784 →
Publication: US 2013/0299855
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 15, 2013
From: KU, HAO-WEI; WANG, CHUNG YU; TANG, YU-SHENG; CHEN, HSIN-HUNG
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 030796/0329 →
Merger Mar 26, 2016
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 038107/0962 →
Change of Name Mar 26, 2016
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 038263/0076 →
Change of Name Apr 22, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075513/0783 →